Growing community of inventors

Boise, ID, United States of America

Sameer S Vadhavkar

Average Co-Inventor Count = 2.70

ph-index = 5

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 77

Sameer S VadhavkarJaspreet Singh Gandhi (15 patents)Sameer S VadhavkarJames M Derderian (14 patents)Sameer S VadhavkarXiao Li (11 patents)Sameer S VadhavkarJian Li (10 patents)Sameer S VadhavkarAnilkumar Chandolu (9 patents)Sameer S VadhavkarWayne H Huang (7 patents)Sameer S VadhavkarDavid R Hembree (5 patents)Sameer S VadhavkarSteven K Groothuis (5 patents)Sameer S VadhavkarOwen R Fay (4 patents)Sameer S VadhavkarSuresh Yeruva (4 patents)Sameer S VadhavkarKyle K Kirby (2 patents)Sameer S VadhavkarAdriel Jebin Jacob Jebaraj (2 patents)Sameer S VadhavkarGiorgio Mariottini (2 patents)Sameer S VadhavkarTim J Corbett (1 patent)Sameer S VadhavkarMark Bossler (1 patent)Sameer S VadhavkarMark Bossier (1 patent)Sameer S VadhavkarJames M Dedderian (0 patent)Sameer S VadhavkarSameer S Vadhavkar (34 patents)Jaspreet Singh GandhiJaspreet Singh Gandhi (94 patents)James M DerderianJames M Derderian (54 patents)Xiao LiXiao Li (51 patents)Jian LiJian Li (59 patents)Anilkumar ChandoluAnilkumar Chandolu (55 patents)Wayne H HuangWayne H Huang (24 patents)David R HembreeDavid R Hembree (365 patents)Steven K GroothuisSteven K Groothuis (25 patents)Owen R FayOwen R Fay (109 patents)Suresh YeruvaSuresh Yeruva (4 patents)Kyle K KirbyKyle K Kirby (210 patents)Adriel Jebin Jacob JebarajAdriel Jebin Jacob Jebaraj (4 patents)Giorgio MariottiniGiorgio Mariottini (2 patents)Tim J CorbettTim J Corbett (54 patents)Mark BosslerMark Bossler (6 patents)Mark BossierMark Bossier (1 patent)James M DedderianJames M Dedderian (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (33 from 38,002 patents)


34 patents:

1. 11929456 - Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods

2. 11776877 - Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

3. 11735549 - Methods and systems for manufacturing pillar structures on semiconductor devices

4. 11631630 - Pillar-last methods for forming semiconductor devices

5. 11139258 - Bonding pads with thermal pathways

6. 11081460 - Methods and systems for manufacturing pillar structures on semiconductor devices

7. 10957625 - Pillar-last methods for forming semiconductor devices

8. 10916527 - Apparatuses and methods for semiconductor die heat dissipation

9. 10886244 - Collars for under-bump metal structures and associated systems and methods

10. 10784224 - Semiconductor devices with underfill control features, and associated systems and methods

11. 10770435 - Apparatuses and methods for semiconductor die heat dissipation

12. 10748878 - Semiconductor device assembly with heat transfer structure formed from semiconductor material

13. 10580746 - Bonding pads with thermal pathways

14. 10573612 - Bonding pads with thermal pathways

15. 10559551 - Semiconductor device assembly with heat transfer structure formed from semiconductor material

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
12/31/2025
Loading…