University of Central Florida Research Foundation, Inc.

Applied Materials, Inc.

Cc Technologies Laboratories, Inc.

Netapp, Inc.

Sameer Deshpande

Sudipta Seal

Eric Petersen

Suresh Chandra Kuiry

Hung Chih Chen

Swanand D Patil

Stan D Tsai

Shou-Sung Chang

Jason Garcheung Fung

Sivakumar Dhandapani

William P Jepson

Jennifer Small

Metthew Stephens

Jason Arvanetes

Charles C Garretson

Wen-Chiang Tu

Gregory E Menk

Daxin Mao

Harihara Kadayam

Gautam Shashank Dandavate

Samuel Chu-Chiang Hsu

Hrishikesh Keremane

Vaiapuri Ramasubramaniam

Zhihong Wang

Roy C Nangoy

Chaitanya V Patel

Rishabh Mittal

Christopher Cocca

Santhosh Unnikrishnan

Asheesh Jain

Swanand H Patil

Embodiments herein include carrier loading stations and methods related thereto which may be used to beneficially remove nano-scale and/or micron-scale particles adhered to a bevel edge of a substrate before polishing of the substrate. By removing such contaminates, e.g., loosely adhered particles of dielectric material, from the bevel edge, contamination of the polishing interface can be avoided thus preventing and/or substantially reducing scratch related defectivity associated therewith.

Polishing system apparatus and methods for defect reduction at a substrate edge

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller. The controller is configured to store data associating each of a plurality of conditioner disk products with a respective threshold value, receive an input selecting a conditioner disk product from the plurality of conditioner disk products, determine a particular threshold value associated with the selected conditioner disk product, receive a signal from the monitoring system, generate a measure of a pad cut rate from the signal, and generate an alert if the pad cut rate falls beyond the particular threshold value.

Pad conditioner cut rate monitoring

A technique efficiently configures a peered cluster storage environment. The configuration technique illustratively includes three phases: a discovery phase, a node setup phase and a cluster setup phase. The discovery phase may be employed to initiate discovery of nodes of a disaster recovery (DR) group through transmission of multicast advertisement packets by the nodes over interconnects, including a Fiber Channel (FC) fabric, to each other node of the group. In the node setup phase, each node of a cluster assigns its relationships to the nodes discovered and present in the FC fabric; illustratively, the assigned relationships include high availability (HA) partner, DR primary partner and DR auxiliary partner. In the cluster setup phase, the discovered nodes of the FC fabric are organized as the peered cluster storage environment (DR group) configured to service data in a highly reliable and available manner.

Configuration of peered cluster storage environment organized as disaster recovery group

A chemical mechanical polishing apparatus includes a carrier head including a retaining ring having a plastic portion with a bottom surface to contact a polishing pad, an in-situ monitoring system including a sensor that generates a signal that depends on a thickness of the plastic portion, and a controller configured to receive the signal from the in-situ monitoring system and to adjust at least one polishing parameter in response to the signal to compensate for non-uniformity caused by changes in the thickness of the plastic portion of the retaining ring.

Monitoring retaining ring thickness and pressure control

A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

Closed-loop control for effective pad conditioning

Nano-sized rare earth metal oxide particles are prepared from aqueous reverse micelles. The engineered nanoparticles have large surface area to volume ratios, and uniformly incorporate a surfactant in each particle, so that when applied to the inner surface of a pipeline or sprayed onto a fluid stream in a pipeline, the particles reduce the roughness of the inside surface of pipe being used to transport fluid. The application of a nanolayer of this novel nanoceria mixture causes a significant reduction in pressure drops, friction, and better recovery and yield of fluid flowing through a pipeline.

Surfactant incorporated nanostructure for pressure drop reduction in oil and gas lines

Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioning disk. The conditioning disk removes enough material so the polishing surface can properly process the wafers but does not remove any excess material. Preventing excess material removal extends the life of the polishing pad. During CMP processing, the controller receives data concerning the torque applied to the conditioning disk and the torque applied to the arm to sweep the conditioning disk across the polishing pad. Based upon the detected operating conditions, the system can predict the rate of material removal and adjust the forces applied to the conditioning disk so that the life of the polishing pad is optimized.

In-situ performance prediction of pad conditioning disk by closed loop torque monitoring

Adding nanoparticles as a catalyst to solid propellant fuel to increase and enhance burn rates of the fuel by up to 10 times or more and/or modifying the pressure index. A preferred embodiment uses TiOnanoparticles mixed with a solid propellant fuel, where the nanoparticles are approximately 2% or less of total propellant mixture. The high surface to volume ratio of the nanoparticles improve the performance of the solid propellant fuel.

Burn rate sensitization of solid propellants using a nano-titania additive

Novel nano-sized rare earth metal oxide prepared from aqueous reverse micelles is provided. The engineered nanoparticles have large surface area to volume ratios, and sufficient oxygen vacancies on the surface of each particle, so that when mixed with carbon-containing combustible fuels, the particles remain suspended indefinitely; there is a significant reduction in soot and other by-products of combustion, an increase in engine efficiency and less fuel consumed per mile traveled in various vehicles, such as, but not limited to, automobiles, defense vehicles, airplanes, ships and other surface or air-bearing vehicles.

Nanoparticles for soot reduction

Use of oxide nanoparticles in soot reduction

Growing community of inventors

Milpitas, CA, United States of America

Sameer Deshpande