Mitsui Chemicals, Inc.

Pfg IP LLC

Sambo He

Ronald D Blum

William Kokonaski

Yongping Wang

Mark Graham

W Eric Boyd

Claudio Dalla Longa

Christian Krutzik

A cap chip or high density reroute layer for use in a stacked microelectronic module. A first set of electrically conductive reroute layers are defined on a sacrificial substrate. One or more stud bump columns are defined on an exposed conducive pad on a conductive reroute layer. One or more active or passive electronic elements, or both may be electrically coupled to one or more exposed conductive pads. The layer is encapsulated in an encapsulant and the stud bump columns exposed by removing a portion of the encapsulant. A second set of electrically conductive reroute layers is defined on the layer and electrically coupled to the stud bumps. The sacrificial substrate is removed to provide a cap chip or reroute layer.

Cap chip and reroute layer for stacked microelectronic module

Aspects of the present invention provide electronics for controlling and synchronizing operation of electro-active lenses regardless of frame type, size or style. The controlling electronics can be contained within one or more electronic modules positioned within the frame temples and can be removable and reprogrammable and can include inductive charge regions. Conductive links between electronic modules and/or between left and right Sides of the electro-active spectacles can include left and right upper and lower rim portions of the frame, the bridge, conductive layers of the electro-active lenses, the upper and lower grooves of the electro-active lenses, and/or wires embedded within any portion of the frame. Aspects of the present invention also provide chargers for recharging electro-active spectacles of any size, shape or style using adjustable inductive charging cradles to inductively charge electro-active spectacles of the present invention.

Electro-active spectacles and associated electronics

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Riverside, CA, United States of America

Sambo He