Finisar Corporation

Samantha R Bench

Rudolf J Hofmeister

John C Dirkson

Darin James Douma

Dmitri Bannikov

Alex Fishman

Konstantinos G Haritos

Ruldolf J Hofmeister

Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.

Systems, devices and methods for thermal testing of an optoelectronic module

An electronic assembly tester for testing an electrical component of an optoelectronic device. The electrical component includes a transmit and receive port. The tester includes of a base, an arm, and a hinge. The arm includes a flex circuit and cables. The arm is rotated into a closed position to form a temporary electrical connection between the electrical component and the flex circuit. Other configurations for forming a temporary electrical connection between the test circuit and the electrical component are possible. The electrical component is evaluated by providing a data signal to the transmit portion of the electrical component and evaluating a return data signal obtained from the receive portion of the electrical component.

Electronic assembly tester and method for optoelectronic device

Systems and methods are provided for configuring an optoelectronic device so as to control various operating conditions at various temperatures. The method includes operating the optoelectronic device at a first temperature, adjusting a first control parameter of the optoelectronic device to satisfy a first operating requirement and recording an associated first value of the first control parameter. Further, the method includes operating the optoelectronic device at a second temperature, adjusting the first control parameter of the optoelectronic device to satisfy the first operating requirement, and recording an associated second value of the first control parameter. From the first and second recorded values of the first control parameter, a sequence of values for the first control parameter for a corresponding sequence of temperatures in a predefined range of temperatures is determined and stored in a programmable device within the device. In addition, one or more control parameters may be adjusted at each temperature to satisfy one or more operating requirements.

Temperature and jitter compensation controller circuit and method for fiber optics device

An exemplary optoelectronic transceiverincorporating features of the present invention is shown in FIGS.and. The transceivercontains a receiver circuit, a transmitter circuit, a power supply voltageand ground connections. The receiver circuit of the transceiver includes a Receiver Optical Subassembly (ROSA), which may contain a mechanical fiber receptacle as well as a photodiode and pre-amplifier (preamp) circuit. The ROSAis in turn connected to a post-amplifier (postamp) integrated circuit, the function of which is to generate a fixed output swing digital signal which is connected to outside circuitry via the RX+ and RX&#x2212; pins. The postamp circuitalso often provides a digital output signal known as Signal Detect or Loss of Signal indicating the presence or absence of suitably strong optical input. The postamp circuitdoes not necessarily have to be used to generate the Signal Detect or Loss of signal. In alternative embodiments, the postamp circuitcould be replaced with a CDR ('Clock Data Recovery') or a demux chip, which embodiments are not shown.

An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.

Method and apparatus for testing PCBA subcomponents

A system for using an electrical adapter to test an electrical device is provided. The system includes a tester, an electrical device, and the electrical adapter. The electrical adapter includes a board having first and second planar surfaces, a first electrical socket coupled to the first planar surface of the printed circuit board and a second electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the first and second electrical sockets to each other. The first electrical socket of the adapter is suitable for temporary connection to an electrical interface of the tester, and the second electrical socket is suitable for temporary connection to an electrical interface of the electrical device. The electrical device can be one of a plurality of electrical devices and the tester can be one of a plurality of testers.

Electrical testing system with electrical adapter

An electrical adapter is provided including a board having first and second planar surfaces, a male electrical socket coupled to the first planar surface of the printed circuit board and a female electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the male and female electrical sockets. The male electrical socket of the adapter is suitable for temporary connection to a female electrical interface of a first electrical device, and the female electrical socket is suitable for temporary connection to a male electrical interface of a second electrical device. The opposing socket is suitable for temporary connection to a printed circuit board. In one embodiment, the electrical device is an optoelectronic device.

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Whitefish, MT, United States of America

Samantha R Bench