Axalume, Inc.

Apple Inc.

Appl Inc.

Saman Saeedi

Ashok V Krishnamoorthy

Shih Chang Chang

Victor H Yin

Xuezhe Zheng

Shinya Ono

Jock T Bovington

Shafiq M Jamal

Kyung Wook Kim

Szu-Hsien Lee

Jason N Gomez

Pei-En Chang

Yu-Heng Cheng

Nikolaus Hammler

Donggeon Han

Suk Won Hong

Hongwoo Lee

Kingsuk Brahma

Ahmad Al-Dahle

Sang Young Youn

Taif Ahmed Syed

Rungrot Kitsomboonloha

Young-Jik Jo

Joyan Gratian Sanctis

Joyan G Sanctis

An electronic device may have a display with touch sensors. One or more shielding layers may be interposed between the display and the touch sensors. The shielding layers may include shielding structures such as a conductive mesh structure and/or a transparent conductive film. The shielding structures may be actively driven or passively biased. In the active driving scheme, one or more inverting circuits may receive a noise signal from a cathode layer in the display and/or from the shielding structures, invert the received noise signal, and drive the inverted noise signal back onto the shielding structures to prevent any noise from the display from negatively impacting the performance of the touch sensors. In the passive biasing scheme, the shielding structures may be biased to a power supply voltage.

Shielding for electronic device displays with touch sensors

An optical source may include an optical gain chip that provides an optical signal and that is optically coupled to an SOI chip. The optical gain chip may include a reflective layer. Moreover, the SOI chip may include: a first optical waveguide, a first ring resonator that selectively optically coupled to a second optical waveguide and that performs phase modulation and filtering of the optical signal, the second optical waveguide, an amplitude modulator, and an output port. Note that the reflective layer in the optical gain chip and the amplitude modulator may define an optical cavity. Furthermore, a resonance of the first ring resonator may be aligned with a lasing wavelength, and the resonance of the first ring resonator and a resonance of the amplitude modulator may be offset from each other. Additionally, modulation of the first ring resonator and the amplitude modulator may be in-phase with each other.

Single-pass ring-modulated laser

An optical source may include an optical gain chip that provides an optical signal and that is optically coupled to an SOI chip. The optical gain chip may include a reflective layer. Moreover, the SOI chip may include: a common optical waveguide, a splitter that splits the optical signal into optical signals, a first pair of resonators that are selectively optically coupled to the common optical waveguide and that are configured to perform modulation and filtering of the optical signals, and a first bus optical waveguide that is selectively optically coupled to the first pair of resonators. Furthermore, resonance wavelengths of the resonators may be offset from each other with a (e.g., fixed) separation approximately equal or corresponding to a modulation amplitude, and a reflectivity of the first pair of resonators may be approximately independent of the modulation.

Rapidly tunable silicon modulated laser

An integrated circuit that includes an optical receiver is described. This integrated circuit may include an optical receiver. The optical receiver may include a photodiode that receives an optical signal and that outputs a corresponding current. Moreover, the optical receiver may include an inductor that is electrically coupled to the photodiode. Furthermore, the optical receiver may include a resistive analog front-end stage that is electrically coupled to the inductor. Note that the inductor may have a resistance per unit length that is greater than a first threshold value (such as 40 m&#x3a9;/&#x3bc;m), and the inductor may be approximately dispersion-less. For example, a Q factor for inductive peaking associated with the inductor is less than a second threshold value (such as 5).

Low-Q inductive-peaking optical front-end

A DC-coupled burst-mode optical receiver is described. The optical receiver may include an input node that receives a current, e.g., from an optoelectronic converter (such as a photodiode). Moreover, the optical receiver may include a current amplifier, coupled to the input node, that provides an output current based at least in part on the current, where the current amplifier has a shunt feedback path that reduces a bias sensitivity of the current amplifier and a feed-forward path that reduces a DC bias current of the current amplifier. Furthermore, the optical receiver may include a TIA, electrically coupled to the current amplifier, that converts the output current to an output voltage. Additionally, the optical receiver may include a feedback loop coupling an output of the TIA to an input of the feed-forward path.

DC-coupled optical burst-mode receiver

Systems, methods, and devices are provided to reduce or eliminate mura artifacts on electronic displays. For example, pixels may be programmed to a uniform gray level before all or a substantial number of gates of the pixels are activated. The voltages on some or all source lines that supply the pixels may be measured. A mura artifact may be seen when voltage differences on the source lines are present. As such, operational parameters of the electronic display may be adjusted to reduce or eliminate the mura artifact by reducing the voltage differences.

Systems and methods for calibrating a display to reduce or eliminate mura artifacts

The present disclosure is directed to systems and methods for determining sheet resistance values in a liquid crystal display (LCD) panel. In certain embodiments, a system for determining sheet resistance values in an LCD panel may include a display driver integrated circuit (IC). The display driver IC may include a first switch coupled to a first input/output (I/O) pad and a second I/O pad such that the first I/O pad is configured to couple to a voltage source and the second I/O pad is configured to couple to a current source. The display driver IC may also include a second switch coupled to a third I/O pad and the second I/O pad such that the second switch has substantially the same geometry as the first switch and the third I/O pad is configured to couple to a thin-film transistor (TFT) layer of the display panel.

Systems and methods for measuring sheet resistance

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San Diego, CA, United States of America

Saman Saeedi