Apple Inc.

Eoplex Limited

Sam Mahin Shirazi

Henry Hung Yang

Philip Eugene Rogren

Alex Shaikevitch

Eric T Chiang

Yong Gang Li

Tiexuan Wang

Matthew Burke

Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.

Method of reliably bonding solid metal piece to rigid PCB

An electrical system includes: a first base structure; a second base structure spaced apart from and opposing the first base structure; a lens unit including a first end portion attached to the first base structure and a second end portion attached to the second base structure; a first light source attached to the first base structure and enclosed within the lens unit; and a second light source attached to the second base structure and enclosed within the lens unit.

Electrical system with lighting configuration and method of manufacture thereof

Growing community of inventors

San Jose, CA, United States of America

Sam Mahin Shirazi