Vishay-siliconix

Siliconix Taiwan Ltd

Siliconx (taiwan) Ltd.

Sam Kuo

Frank Kuo

Sen Mao

Mohammed Kasem

King Owyang

Yuming Bai

Oscar Ou

A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

Complete power management system implemented in a single surface mount package

A die pad ( ) of a leadframe ( ) has a plurality of slots ( ) that extend through the die pad to define a restrictive region ( ). One of the slots extends around a comer of the restrictive region outside where a die ( ) is connected to the die pad by solder paste ( ). Because of the cohesion of the solder paste, the solder paste does not flow into the slots. The solder paste is thereby restricted to the restrictive region. This prevents the die from drifting or rotating so as to increase the packaging quality.

Leadframe having slots in a die pad

A power semiconductor device includes a die having a drain contact, a source contact, a primary gate contact, a partitioning region that partitions the source contact, and a secondary gate contact disposed in the partitioning region. A conductive strip is connected to the primary and secondary gate contacts. An insulation layer encloses a segment of the conductive strip. A conductive connecting member includes a metal sheet and a conductive paste. The metal sheet is attached to the source contact via the conductive paste and is formed with a groove to expose the insulation layer from the metal sheet.

Power semiconductor device

Growing community of inventors

Ping-Dong, Taiwan

Sam Kuo