Lockheed Martin Corporation

Sam J Waldbaum

Nicholas D Saiz

Various aspects of the disclosure provide high power and high efficiency power amplifier systems that can be integrated on a chip using integrated circuit processes such as a standard CMOS and SiGe process. A power amplifier system is disclosed according to one aspect. The power amplifier system comprises a first power amplifier, a Wilkinson power splitter, second-stage amplifiers, and a Wilkinson power combiner. The first power amplifier pre-amplifies an RF input signal. The Wilkinson power splitter then splits the power of the amplified RF signal outputted by the first power amplifier among the second-stage amplifiers. Each of the second-stage amplifiers amplifies the respective RF signal from the Wilkinson power splitter. The Wilkinson power combiner then sums the powers of the amplified RF signals outputted by the second-stage amplifiers and outputs the resulting combined RF signal.

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Mountain View, CA, United States of America

Sam J Waldbaum