E.i. Dupont De Nemours and Company

Sam Andreades

John W Lott

Grant A Beske

Richard L Baird

Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.

Use of photosensitive stratum to create through-hole connections in

Described are random linear copolymers of certain cyclopropenes, e.g., cyclopropene or 1-methylcyclopropene, with certain ethylenically unsaturated or strained ring monomers, e.g., ethylene, acrylonitrile, 2-chlorobutadiene or 1-cyanobicyclo[1.1.0]butane. Prepared by direct interaction between the monomers, the copolymers are useful film- and fiber-formers.

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Red Bank, NJ, United States of America

Sam Andreades