Texas Instruments Corporation

Salvatore P Rizzo

Randal D Roebuck

Henry J Boulanger

Fariborz Agahdel

William J LaPlante

Masahiro Fuchigami

Socket apparatus (10) particularly adapted for use of burn-in tests of IC components having a large number of contact points on the bottom surface thereof has a cover frame (16) and adapter plate (22) movably mounted on a base (16). A latch assembly (30) is pivotably mounted on the base (12) at each side thereof and is linked to the cover frame so that when the cover frame is moved downwardly toward the base against the bias of spring members (20) each latch member (30a) is pivoted away from the seating surface allowing an IC component to be inserted into the socket or removed from the socket. When the cover frame (16) is allowed to return to its normal, at-rest position, each latch member pivots toward the base member to a position overlying the seating surface and engages an IC component received on the seating surface and transfers a force through the IC component to the adapter plate thereby lowering the adapter plate and exposing contact elements (14) so that they engage respective contact points of the IC component. In a modified embodiment (10') heat sink assemblies (40) are mounted for movement with two opposing latch assemblies (30). Each heat sink assembly comprises a head (42) movable between inner and outer positions so that the head can be brought into engagement with an IC component with a selected level of spring force for optimum thermal coupling.

Burn-in test socket apparatus

An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21). The interconnection system (8') provides non-destructive interconnection to semiconductor device (21).

Non-destructive interconnect system for semiconductor devices

An interconnect system (8) for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) with retractable contact portions (14) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b), a plurality of contact bumps (24) containing oxide-penetrating particles on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21), a fence (30) attached to the top surface of the compliant membrane (20b) for positioning the semiconductor device (21) so that the bond pads on the semiconductor device (21) are aligned with the contact bumps (24). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The interconnection system (8) provides non-destructive interconnection to semiconductor device (21).

An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21). The interconnection system ( 8') provides non-destructive interconnection to semiconductor device (21).

A circuit board edge member includes an elongated body of electrically insulative material having front, back and inner wall members and a plurality of pairs of contact elements seated with one of each pair between the front and inner walls and the other of each pair between the back and inner walls. A tongue is integrally attached to the inner wall and extends from the body in line with a circuit board receivable at a circuit board seat formed in the body. The contact elements are formed with a gold inlay solid phase bonded to a portion of the contact element which is received on opposite faces of the tongue. The tongue has a reverse taper and may be slotted to provide polarization. Mounting ears may be provided on opposite ends of the base to facilitate attachment of the edge member to a circuit board using conventional screw fasteners or snap in devices. The edge member is assembled by inserting contacts while still attached to a carrier web in two opposite directions, severing the contacts from the carrier web and bending their pin ends to form two rows of contact pins receivable in two rows of holes in the circuit board. A flexible, U-shaped mask is placed over the tongue to prevent contamination during wave soldering.

Attachable, circuit-terminating, circuit board edge member

A circuit board edge member includes an elongated body of electrically insulative material having front, back and inner wall member and a plurality of pairs of contact elements seated with one of each pair between the front and inner walls and the other of each pair between the back and inner walls. A tongue is integrally attached to the inner wall and extends from the body in line with a circuit board receivable at a circuit board seat formed in the body. The contact elements are formed with a gold inlay solid phase bonded to a portion of the contact element which is received on opposite faces of the tongue. The tongue has a reverse taper and may be slotted to provide polarization. Mounting ears may be provided on opposite ends of the base to facilitate attachment of the edge member to a circuit board using conventional screw fasteners or snap in devices. The edge member is assembled by inserting contacts while still attached to a carrier web in two opposite directions, severing the contacts from the carrier web and bending their pin ends to form two rows of contact pins receivable in two rows of holes in the circuit board. A flexible, U-shaped mask is placed over the tongue to prevent contamination during wave soldering.

Mask for an attachable, circuit-terminating, circuit board edge member

A switch assembly comprises a deformable electrically insulative substrate with a plurality of grooves formed therein extending in a direction parallel to a given axis. Electrically conductive wires are disposed in the grooves and extend beyond one end of the substrate. The grooves have a width and a depth such that the wires are accurately positioned in the substrate and securely held therein. The wire is secured in the groove by a tool having a concaved end portion which stradles the wire and is moved toward the substrate until the cut out portion essentially contacts the top of the wire, and the substrate material flows onto the wire for locking the wire in the groove.

Method for mounting electrically conductive wires to a substrate

A switch assembly comprises a deformable electrically insulative substrate with a plurality of grooves formed therein extending in a direction parallel to a given axis. Electrically conductive wires are disposed in the grooves and extend beyond one end of the substrate. The grooves have a width and a depth such that the wires are accurately positioned in the substrate and securely held therein. Flexible, electrically conductive strips having a column of dome shaped portions or discs overlie the wires, each dome being formed with a centrally located projection which moves into engagement with a wire when the dome is depressed. Materials for the electrically conductive members are so chosen as to minimize corrosion problems. In the preferred embodiment, the strips are formed of a high strength brass, bus wires are of nickel containing bronze and contact wires are of nickel containing brass. A layer of electrically insulative, flexible material overlies the substrate and strips and is sealingly attached to the exposed top surface of the strips and substrate. The wires are attached to a transversely extending bar intermediate the substrate and the free end of the wires to facilitate connection to a motherboard.

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Norwood, MA, United States of America

Salvatore P Rizzo