Sensortechnics Gmbh

Salman Saed

Oleg Grudin

Leslie M Landsberger

Gennadiy Frolov

Tommy Tsang

Bowei Zhang

L Richard Williston

There is described a flow sensing device having a semiconductor chip with a flow channel integrated therein and a sensing element positioned in the flow channel, and a package base attached to the semiconductor chip and allowing access to the two passage-openings of the flow channel from opposite sides of the package base.

Flow sensing device and packaging thereof

A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.

Multi-structure thermally trimmable resistors

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Montreal, Canada

Salman Saed