General Dynamics Land Systems, Inc.

Sally M Sellers

Ernest J Morrow

Gary D Knudsen

A modular spray cooling system for cooling electronic components in enclosures containing electronic components that dissipate heat and therefore require cooling. The modular system is mounted in a sealed enclosure with an inside wall . A spray cooling module is detachably mountable within the sealed enclosure . The coolant is distributed to a spray manifold card that is provided with nozzles. Localized cooling is accomplished with the use of individual nozzles . The spray cooling module atomizes the evaporative coolant through nozzles so that liquid droplets of the coolant are delivered to the electronic components, and cooling of the components occurs upon evaporation. A method for cooling electronic components comprises the steps of: providing a sealed enclosure ; priming the sealed enclosure with an evaporative coolant that recirculates therewithin; detachably placing within the enclosure one or more sealed circuit card assemblies containing the electronic components to be cooled; a spray cooling module within the enclosure and delivering power to a pump within a spray cooling module that is also detachably mountable within the sealed enclosure

Modular spray cooling system for electronic components

The invention is a method for increasing the capacity of an electrical component, such as a bus bar, to carry an electrical current. The method comprises the step of exposing the electrical component to an evaporative fluid that is in fluid and thermal contact with the electrical component. Upon heating, fluid undergoes a phase change at least partially to a vapor state. Thus, electrical energy in the form of heat generated by the flow of current is dissipated at least partially by the evaporative fluid. As a result, the temperature of the electrical component is maintained within an acceptable range when carrying the electrical current.

Evaporative cooling of electrical components

A method for cooling bus bars in order to increase their current-carrying capacity while saving space and weight. The method comprises the steps of providing a housing having an interior wall; locating a distribution manifold within the housing, the distribution manifold comprising a hollow bus bar ; communicating to the manifold a supply of an evaporative coolant &prime;; and delivering the coolant &prime; outwardly under pressure so that upon exiting the manifold , the coolant &prime; undergoes a phase change from the liquid to the vapor state. Heat is extracted from the manifold at least as quickly as heat is generated by the flow of current. The extraction of heat by the flow of coolant &prime; and evaporation maintains or lowers the temperature of the bus bar and enables a given size of bus bar to carry more current without a significant rise in temperature. The invention also includes an apparatus for cooling bus bars in an electrical circuit. The bus bars are mounted in close proximity with each other, thereby saving space and weight in the electrical circuit and providing good electrical noise immunity.

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Tallahassee, FL, United States of America

Sally M Sellers