Merck Patent Gmbh

Salem Mullen

M Dalil Rahman

JoonYeon Cho

The disclosed subject matter relates to a rinse and methods of use thereof for removing an edge protection layer and residual hardmask components (e.g., metals) from the edge and at least one proximate surface of a wafer/substrate where the rinse includes acetic acid and/or a halogenated acetic acid of structure (A) wherein Rand Rare independently hydrogen or a halogen and Ris a halogen and (ii) a compound having structure (B) wherein each of R, R, R, R, R, R, Rand Rh may independently be hydrogen, a substituted or an unsubstituted alkyl group, a substituted or an unsubstituted halogenated alkyl group, a substituted or an unsubstituted alkyl carbonyl group, a halogen, and a hydroxy group.

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Florham Park, NJ, United States of America

Salem Mullen