Mitsui Minings & Melting Co., Ltd.

Sumitomo Metal Industries, Inc.

Nippon Stainless Steel Kozai Co., Ltd

Sakiko Tomonaga

Makoto Dobashi

Hisao Sakai

Mitsuyoshi Matsuda

Junshi Yoshioka

Ayumu Tateoka

Shinichi Obata

Hideaki Matsushima

Hiroshi Tanaka

Koichi Miyake

Jo Nishikawa

Atsuhiko Kuroda

Tomoyuki Maeda

Tomohiro Sakata

Takeo Taguchi

Shinya Hiraoka

Isamu Kanekatsu

Yutaka Kiminami

Satoru Fujita

Fumiaki Hosokoshi

An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350&#xb0; C. to 400&#xb0; C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/mto 1,000 mg/m; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.

Surface-treated copper foil

It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.

Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 &#x3bc;m to 0.7 &#x3bc;m, the maximum peak to valley height (PV) to be 0.05 to 1.5 &#x3bc;m, and the surface roughness (Rzjis) to be 0.1 &#x3bc;m to 1.0 &#x3bc;m. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

Surface-treated electro-deposited copper foil and method for manufacturing the same

An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film

The purpose is to provide a cathode electrode for manufacturing an electrodeposited copper foil which is possible to be continuously and stably usable for a long duration of 3000 hours or longer to subsequently lessen the frequency of maintenance work execution as low as possible and to contribute to lower the running cost of the electrodeposited copper foil manufacture. As the means for achieving the purpose, a cathode electrode made of a titanium material is employed for obtaining an electrodeposited copper foil using an electrolytic copper solution and the titanium material having 7.0 or higher crystal grain size number and 35 ppm or lower initial hydrogen content is used for manufacturing the cathode electrode for manufacturing an electrodeposited copper foil. Further, also provided is a manufacturing method of the titanium material to be employed for the cathode electrode made of a titanium material.

Titanium-made cathode electrode for producing electrolytic copper foil, rotary cathode drum using the titanium-made cathode electrode, method of producing titanium material using titanium-made cathode electrode and method of correcting/working titanium material for titanium-made cathode electrode

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Tokyo, Japan

Sakiko Tomonaga