Mitsui Minings & Melting Co., Ltd.

Sakiko Taenaka

Makoto Dobashi

Akiko Sugimoto

Noriko Hanzawa

Kenzo Hanawa

Naotomi Takahashi

Takuya Yamamoto

Takashi Kataoka

Junshi Yoshioka

Tsutomu Higuchi

Ken-ichiro Iwakiri

Osamu Nakano

Naohito Uchida

An object of the present invention is to reduce and to stabilize peel strength of a carrier foil in an electrodeposited copper foil with carrier employing an organic adhesive interface, thereby facilitating peeling of the carrier foil. The electrodeposited copper foil with carrier of the present invention contains a carrier foil layer, an organic adhesive interface layer formed on the carrier foil layer, and an electrodeposited copper foil layer formed on the organic adhesive interface layer, wherein the difference between the coefficient of thermal expansion of material forming the carrier foil layer at a certain temperature and that of material forming the electrodeposited copper foil at the same temperature is 4&times;10 /deg.C or more.

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil

An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To attain the object, in electroforming, a titanium material having a grain size number of 6.0 or more is employed as a copper deposition surface of the rotating drum cathode, and glue and/or gelatin is added in an amount of 0.2-20 mg/l to a copper sulfate solution, thereby producing a drum foil. An electrodeposited copper foil obtained from the drum foil, wherein 20% or more of the crystals present in a shiny side surface of the electrodeposited copper foil have a twin-crystal structure, is used for producing copper-clad laminates.

Electrodeposited copper foil

To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil

A cathodic active material comprises a mixture of graphite particles and electrolytic manganese dioxide particles which are composed of needle-like crystals having an aspect ratio ranging from about 2 to about 20 and an alkaline manganese dioxide cell is provided with a cathode prepared from the cathodic active material. The cathodic active material for dry cells can be prepared by mixing, in advance, carbon powder with manganese dioxide powder in a weight ratio ranging from about 1:100 to about 15:100 and then pulverizing the resulting mixture. The novel cathodic active material for dry cells permits substantial improvement of the resulting dry cell in the high load-discharge quality.

Cathodic active material composition for dry cells, method for preparing

Growing community of inventors

Ageo, Japan

Sakiko Taenaka