Nec Corporation

Showa Denko K.k.

Japan E.m. Co., Ltd.

Nec Toppan Circuit Solutions, Inc.

Other

Nitto-denko Corporation

Sakae Kitajo

Yuzo Shimada

Mikio Oda

Ichiro Hazeyama

Mitsuru Yamamoto

Kazuyuki Mikubo

Masahiro Kubo

Hikaru Kouta

Hideo Kikuchi

Yasuhiro Sasaki

Takao Yamazaki

Yoshimichi Sogawa

Kazuhiko Futakami

Tomotaka Ishida

Akeo Katahira

Koji Soejima

Atsushi Ochi

Koji Matsui

Kazumasa Igarashi

Hidehiko Kuroda

Hirobumi Inoue

Masahiko Fujiwara

Yoshinobu Kaneyama

Masaru Terashima

Kazuo Taga

Jun Ishida

Kazuhiro Kumakura

Junichi Sasaki

Hiroshi Noro

Masataka Itoh

Kazuhito Murata

Masataka Ito

Yoshio Matsumoto

Yoshinori Katada

Sunao Hamamura

Shinichi Tamabayashi

Seiji Suda

Shinichi Ishiduka

Susumu Nanko

Hitoshi Anma

Tosiji Yamada

An electronic device cooling apparatus including a cooling device including a heat conductive plate formed with a flow path, a circulating pump, a liquid storage tank upper chamber and lower chamber provided on the upper and lower side of the heat conductive plate, and a bypass provided with the heat conductive plate so as to allow the cooling medium to pass through the liquid storage tank upper chamber and the liquid storage tank lower chamber.

Electronic device cooling apparatus

A pump chamber () is formed between a piezoelectric vibrator () and a valve main plate (). The valve main plate () includes an inlet port () at its central portion, and an outlet port () in its peripheral portion, and the inlet port () is made in a smaller diameter than the outlet port (). On the valve main plate () an inflow check valve () and an outflow check valve () are provided, so that when the inflow check valve () and the outflow check valve () open and close in response to the vibration of the piezoelectric vibrator (), a fluid is introduced into and discharged from the pump chamber ().

Diaphragm pump

A liquid-cooled heat radiatorincludes a heat radiation basehaving a cooling-liquid channel, and an expansion tankprovided on the heat radiation base. The expansion tankhas a tank bodyhaving an expanded portion, which expands upward and opens downward, and a bottom platejoined to the lower end of the tank bodyto thereby close a bottom opening of the expanded portion. A through-holeis formed in the top wall of the expanded portionof the tank bodyand serves as a communication section for establishing communication between the interior and the exterior of the cooling-liquid channel. A hydrogen-permeable memberis fixedly fitted into the through-holeso as to stop the through-hole. The hydrogen-permeable membersatisfies the relation B&#x2267;50 A, where A and B are water-vapor permeability and hydrogen permeability, respectively, of the hydrogen-permeable member. The hydrogen-permeable memberis formed from a single material selected from the group consisting of ethylene-propylene rubber, butyl rubber, fluorine-containing rubber, nitrile-butadiene rubber, and silicone rubber. The liquid-cooled heat radiatorcan be free from an increase in pressure in the cooling-liquid channel

Liquid-cooled heat radiator

An expansion tank devicecomprises a tank installation basehaving a cooling liquid channeland an expansion tankprovided on the upper surface of the installation base. The basehas a communication holefor holding space above the upper surface thereof in communication with the cooling liquid channel. The expansion tankhas a tank main bodyincluding an upwardly bulging portionhaving an opening at its lower end, and a bottom platejoined to the lower end of the tank main bodyfor closing the lower-end opening of the bulging portionand joined to the upper surface of the tank installation base. The bottom plateis provided at a portion thereof corresponding to the communication holewith a through holecommunicating with the communication hole. The bottom plateis provided with a baffle plateformed along the entire circumference of the inner peripheral edge thereof defining the through holeand slanting upwardly toward the center of the through hole. The expansion tank deviceremoves the air in the cooling liquid from the circulating system, precludes the system from breaking and prevents the decrease in the amount of cooling liquid within the circulating system.

Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator

A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus

A piezoelectric element of the piezoelectric pump is driven by the output signal of an amplifier that takes as input a signal that is generated by a sine wave oscillator of the same frequency that drives the piezoelectric element. The amplifier is driven by a high voltage obtained by conversion from a low-voltage power supply by a voltage-boosting converter, whereby the piezoelectric element is driven by a low-frequency sine wave of high voltage. The frequency of the sine wave oscillation is further adjusted by a signal from a first control circuit at the time of activation. In addition, the amplitude of the sine wave oscillation is adjusted by the output signal of a second control circuit that takes as input a signal from temperature sensor for sensing the temperature of the heat-generating body.

Drive circuit for piezoelectric pump and cooling system that uses this drive circuit

A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

Cooling device for an electronic equipment

The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unitand the air cooling unitare formed in a unit. A heat absorption surfaceof the liquid cooling unitis contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box. In the liquid cooling unit, a liquid cooling pumpcomposed of an electromagnetic pump is arranged for circulating the coolant in the flow path. The heat generated by the heat generation components such as CPU, heat generator, and the like is thermally diffused with heat conduction into the whole liquid cooling unitby circulating the coolant with the liquid cooling pump

Cooling device for electronic apparatus

An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) () is mounted on a wiring circuit substrate () under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) () and a circuit electrode () disposed on the wiring circuit substrate () are facing with each other. In addition, the gap between the wiring circuit substrate () and the semiconductor element (flip chip) () is filled by a filling resin layer () comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C).

Electronic component unit

In a method for fabricating an optical circuit, a mirror element with a protection film formed within a die of a semiconductor is connected to a substrate at a predetermined position. The mirror element with the protection film connected to the substrate is peeled from the die of the semiconductor. The protection film is removed to expose a reflection surface of a reflection film of the mirror element.

Optical circuit in which fabrication is easy

A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.

Semiconductor package and laminated semiconductor package

A method of arranging microspheres with liquid, a microsphere arranging device, and a semiconductor device are provided. The method comprising the steps of placing the semiconductor device with a large number of pads with holes, on a loading table with a variable tilt angle, and pouring microspheres together with conductive liquid held in a holding container onto the semiconductor device. The microspheres are storably placed in the holes on the pads of the semiconductor device. The non-stored microspheres and conductive liquid are accumulated in a receiving tank, and the conductive liquid including the accumulated microspheres are transferred to the holding container by a pump.

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

There is disclosed a method of inspecting an optical waveguide substrate for optical conduction at an increased inspecting rate and also inspecting an optical waveguide substrate for cross-talk. According to the disclosed method, a laser beam is applied from a laser beam scanning optical system to one end face of an optical waveguide of an optical waveguide substrate which is an object to be inspected, and the laser beam emitted from the other end of the optical waveguide is detected by a CCD camera, which output detected result data. A light spot position confirming device compares the detected result data with stored data.

Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk

After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.

Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board

Growing community of inventors

Tokyo, Japan

Sakae Kitajo