Asahi Kasei Kogyo Kabushiki Kaisha

Sakae Ito

Hidehiko Kobayashi

Tatsumi Arakawa

Kaoru Ohmura

Tetsuo Shiga

A novel printed circuit board with a circuit of high precision having a polymer coat layer between a base and a dispersion imaging material layer and a pattern circuit on undispersed portions of the dispersion imaging material layer. Such a printed circuit board is prepared by a simplified process which comprises essentially two steps, namely, exposure of the dispersion imaging material through a circuit pattern mask to obtain a pattern circuit of the unexposed portions and conductive metal plating wherein said unexposed portions are selectively deposited with the conductive metal due to the specific effect of provision of the polymer coat layer directly under the dispersion imaging material layer.

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Fuji, Japan

Sakae Ito