Nichia Corporation

Dai Nippon Printing Co., Ltd.

Saiki Yamamoto

Atsushi Yamamoto

Seitaro Akagawa

Takeshi Morikawa

Tomokazu Maruyama

Keiko Ono

Shinya Matsuoka

Motohisa Nogi

Tsuyoshi Okahisa

Masashi Ishida

Tomokazu Yoshida

Hiroaki Ukawa

Norimasa Yoshida

Seiji Tawaraya

Hideo Asakawa

Takanori Akaishi

Kazuyuki Hino

Kensaku Hamada

Hiroshi Kono

Ikuya Nii

A light emitting module includes: a substrate; a plurality of light sources fixed on the substrate and generating individually controllable outputs; a light shielding member disposed between the light sources; a first lens that is disposed above the light sources and on which the light emitted from each of the light sources becomes incident; and a drive unit capable of rotating the substrate. The light sources include a first light source and a second light source. The angle formed by the axis of rotation of the substrate and the optical axis of first light emitted by the first light source and exiting the first lens differs from the angle formed by the axis of rotation and the optical axis of second light emitted by the second light source and exiting the first lens. The second light can irradiate a first circular track having the axis of rotation as its center.

Light emitting module

A light-emitting module including a substrate, a light-emitting device disposed on the substrate, a lens, and an optical sensor. The light-emitting device includes at least one light-emitting element and a light-transmissive member disposed on a light extraction surface of the at least one light-emitting element. The lens is disposed apart from the light-emitting device at a position where the lens faces the light-emitting device. The optical sensor has an upper surface including a light-receiving surface to receive light through the lens and is disposed on the substrate at a position where at least a part of the light-receiving surface faces the lens. A center of the light-emitting device is located at a center of the lens in a plan view.

Light-emitting module and method of manufacturing the same

A light-emitting module includes a substrate, at least one light-emitting element disposed on the substrate, at least one electronic component disposed on the substrate, a lens disposed apart from the at least one light-emitting element and the at least one electronic component to face the at least one light-emitting element and the at least one electronic component, and at least one plate-shaped covering member each disposed between the lens and a corresponding one of the at least one electronic component. The at least one covering member contains a coloring agent.

The light-emitting device includes a first light-emitting element having an emission peak wavelength of 430 nm or more and less than 490 nm, a second light-emitting element having an emission peak wavelength of 490 nm or more and 570 nm or less, a support body at which the first light-emitting element and the second light-emitting element are disposed, and a light-transmissive member containing a red phosphor and covering the first light-emitting element and the second light-emitting element. A content density of the red phosphor in the light-transmissive member in a space between the first and second light-emitting elements is higher in a part below an upper surface of the second light-emitting element than in a part above the upper surface thereof.

Light-emitting device and backlight including light-emitting device

A light emitting device includes an element container and a light emitting element. The element container has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead and includes an indentation at an outer surface, a wire covered with the resin molded body and extending from the first electrode lead to the indentation. The light emitting element is housed in the element container and electrically connected to the first electrode lead and the second electrode lead.

Light emitting device

A composite substrate includes a plate-like lead frame having a plurality of supporting leads and a plurality of element containers supported by the supporting leads. The plurality of element containers each has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead, and within the resin molded body, the first electrode lead, the second electrode lead, and the supporting lead are held spaced apart from one another. At least one of the plurality of element containers has a wire that connects the first electrode lead and the supporting lead and is covered with the resin molded body.

Composite substrate, light emitting device, and method of manufacturing the light emitting device

A light emitting device includes an electrically conductive member, a light emitting element, a wire, and a sealing member. The wire contains gold and silver and connects the electrically conductive member and the light emitting element. The wire includes a ball portion and a recrystallized region. The ball portion is provided on an electrode of the light emitting element. The recrystallized region is provided on the ball portion and has a length in a range of 50 &#x3bc;m to 90 &#x3bc;m. The sealing member has a lower surface and an upper surface opposite to the lower surface and covers the light emitting element and the wire so that the lower surface faces the electrically conductive member and the light emitting element and so that a distance from a top of the ball portion to the upper surface of the sealing member is 90 &#x3bc;m to 230 &#x3bc;m.

Provided is a liquid crystal display device which exhibits power saving property and high display quality and is capable of suppressing the time-dependent degradation in display quality. The above problem is solved by providing a liquid crystal display device comprising a liquid crystal cell unit including a color filter having a transparent substrate and a plurality of coloring layers formed on the transparent substrate, a counter substrate and a liquid crystal layer formed between the color filter and the counter substrate and a backlight unit including a light emitting device having a blue light emitting element, and a red fluorescent substance and a green fluorescent substance, and the plurality of coloring layers has a blue coloring layer containing a color material of a specific triarylmethane-based compound and the red fluorescent substance is a surface-treated M[MMnF] (for example, Mrepresents Kand Mrepresents Si).

Liquid crystal display device and method for manufacturing same

A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes. The package has a back face opposed to the front face and a bottom face that is located between the back face and the front face. The bottom face is adjacent to the front face. The outer lead electrodes protrude from the bottom face of the package. An end of each of the outer lead electrodes branches in at least two distal end parts on the bottom face. One of the distal end parts of each of the outer lead electrodes extends toward one of side faces of the package and is bent along the side face, and other one of the distal end parts of each of the outer lead electrodes extends toward the back face of the package.

To provide a light emitting device that is compact and has high efficiency of extracting light comprising a support body that incorporates a light emitting element. The light emitting device has the protective elementmounted on the electrically conductive memberand the basemounted on the electrically conductive member, while at least part of the protective elementis covered with the base, and the light emitting elementis mounted on the top surface of the base

Light emitting device comprising protective element and base

A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

The semiconductor devicecomprises a housingwhich has a recessin the front surface; a pair of lead electrodeswhich have the distal endsexposed in the recess, protrude from the external surface of the housing, and are bent along the bottom surfaceof the housing; and a semiconductor elementwhich is housed in the recessand is electrically connected to the pair of lead electrodes. The housinghas grooveswhich are formed on the pair of side surfaceswhich adjoin the front surfaceand the bottom surfaceon the right and left sides so as to penetrate the housingfrom the top surfacetoward the bottom surfaceof the housing. The groovespreferably have width substantially equal to the thickness of the lead electrode. The groovesare more preferably formed to be flush with the distal endsof the lead electrode

Growing community of inventors

Tokushima, Japan

Saiki Yamamoto