Apple Inc.

Luminus, Inc.

Saijin Liu

Tongbi T Jiang

Saahil Mehra

Tao Tong

Mathieu Charbonneau-Lefort

Hongtao Ma

Jacky G Ko

An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.

Optical sensor package with magnetic component for device attachment

An embodiment of a barrier assembly includes a housing having an aperture and a magnet at least partially disposed within the housing. A first surface of the magnet is exposed. The barrier assembly also includes a light-emitting component disposed within the aperture. Another embodiment of a barrier assembly includes a housing having a plurality of apertures formed about a perimeter of the housing. The barrier assembly also includes a magnet at least partially embedded within the housing and the magnet includes an opening formed through a center of the magnet and a plurality of light-emitting components, each light-emitting component at least partially disposed within a corresponding aperture of the plurality of apertures.

Systems and methods for magnetic barrier assembly

An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.

Optoelectronic devices with non-rectangular die shapes

An electronic watch includes a frame and a cover. The cover is attached to the frame, and the frame and cover at least partially define an interior volume of the electronic watch. An optical sensor assembly including a light emitter and a light receiver is positioned within the inter volume of the frame. An optical barrier is positioned between the optical sensor assembly and the cover and includes a magnetic material that forms a light blocking-wall between the light emitter and the light receiver. The magnetic material is configured to removably couple the electronic watch with a charging device via a magnetic attraction between the magnetic material and a magnetic component of the charging device.

Optical sensor having a magnetic optical barrier

Methods and apparatus are provided for LED packages with surface textures. In one novel aspect, microstructures are formed on surfaces of the LED package such that light extract efficiency is improved. In one embodiment, the LED package has a silicone-encapsulating layer scattered with phosphors. In another embodiment, the LED package has a leadframe substrate. The microstructure can be micro lens, micro dents, micro pillars, micro cones, or other shapes. The microstructures can be periodically arranged or randomly arranged. In one novel aspect, the compression molding process is used to form rough surfaces. The molding block or the release film is modified with microstructures. In another novel aspect, sandblasting process is used. In one embodiment, microstructures are formed on sidewalls using the sandblasting process. The hardness, the angle, and/or the size of the blasting media are selected to improve the efficiency of the LED package.

LED package with surface textures and methods of formation

Methods and apparatus are provided to improve the yield rate of LED packaging using LED flip chips. In one novel aspect, extended pads made of sintered silver are disposed on the cathode and the anode of the LED flip chip. The thickness of the extended pad is from about 25 &#x3bc;m to about 200 &#x3bc;m. In another embodiment, the LED flip chip further comprises a phosphor layer such that the LED flip chip emits white light. In another novel aspect, the LED flip chip with extended pads made of sintered silver is produced at the wafer level. The wafer level process involves applying sintering silver pastes to the cathode and the anode of each LED flip chip formed on the wafer and sintering the wafer at a temperature about 180&#xb0; C. to about 240&#xb0; C. for about two hours. The wafer is cut to individual LED flip chips with extended sintered silver pads.

Growing community of inventors

San Jose, CA, United States of America

Saijin Liu