University College Cork

Intel Corporation

Saibal Roy

Donald S Gardner

Paul McCloskey

Terence O'Donnell

Brice Jamieson

Dhiman Mallick

Kafil M Razeeb

James Francis Rohan

Pranay Podder

Andreas Amann

Lorraine Christine Nagle

A vibrational energy harvesting device is disclosed, which comprises first and second assemblies mounted on a base at a distance one from the other. The first assembly comprises vibrational means adapted to stretch under a straining force, whereby the device exhibits monostable quartic nonlinearity. The first and second assemblies comprise respective magnetised means in opposite polarity to one another, so that the second assembly exerts a repulsive magnetic force upon the vibrational means, whereby the device exhibits bistability. Both the monostable quartic and bistable nonlinearities can be independently controlled. A method of harvesting energy with the vibrational energy harvesting device is also disclosed.

Broadband vibrational energy harvesting device combining multiple nonlinearity

A thermal interface material () comprises a bulk polymer () within which is embedded sub-micron (c. 200 to 220 nm) composite material wires () having Ag and carbon nanotubes ('CNTs'). The CNTs are embedded in the axial direction and have diameters in the range of 9.5 to 10 nm and have a length of about 0.7 &#x3bc;m. In general the pore diameter can be in the range of 40 to 1200 nm. The material () has particularly good thermal conductivity because the wires () give excellent directionality to the nanotubes ()&#x2014;providing very low resistance heat transfer paths. The TIM is best suited for use between semiconductor devices (e.g. power semiconductor chip) and any type of thermal management systems for efficient removal of heat from the device.

Thermal interface material

Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a magnetic material on a substrate, wherein the magnetic material comprises rhenium, cobalt, iron and phosphorus, and annealing the magnetic material at a temperature below about 330 degrees Celsius, wherein the coercivity of the annealed magnetic material is below about 1 Oersted.

Forming electroplated inductor structures for integrated circuits

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Cork, Ireland

Saibal Roy