Kla Tencor Corporation

Bck Networks, Inc.

Kla-tencor Technologies Corporation

Kla Corporation

Saibal Banerjee

Ashok V Kulkarni

Santosh Bhattacharyya

Jagdish Chandra Saraswatula

Gano Broto Chatterji

Raghava Kondepudy

Brian Duffy

Prasanti Uppaluri

Rajesh Manepalli

John Kirkland

Lisheng Gao

Bjorn Brauer

Ian R Smith

Allen Park

Kris Bhaskar

Joe Wang

Songnian Rong

Christophe Fouquet

David R Bakker

Ping Gu

Igor N Germanenko

Mike Van Riet

Shaoyu Lu

Da Chen

Lian Yao

David Baker

Ian Smith

A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

System and method for generation of wafer inspection critical areas

Methods and systems for shape metric based scoring of wafer locations are provided. One method includes selecting shape based grouping (SBG) rules for at least two locations on a wafer. For one of the wafer locations, the selecting step includes modifying distances between geometric primitives in a design for the wafer with metrology data for the one location and determining metrical complexity (MC) scores for SBG rules associated with the geometric primitives in a field of view centered on the one location based on the distances. The selecting step also includes selecting one of the SBG rules for the one location based on the MC scores. The method also includes sorting the at least two locations on the wafer based on the SBG rule selected for the at least two locations.

Shape metric based scoring of wafer locations

Techniques are provided that can select defects based on criticality of design pattern as well as defect attributes for process window qualification (PWQ). Defects are sorted into categories based on process conditions and similarity of design. Shape based grouping can be performed on the random defects. Highest design based grouping scores can be assigned to the bins, which are then sorted. Particular defects can be selected from the bins. These defects may be reviewed.

Criticality analysis augmented process window qualification sampling

Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with one or more other modes. The computer subsystem(s) are also configured for acquiring, from the storage medium, one or more images generated with the one or more other modes at a location on the specimen corresponding to the first defect. In addition, the computer subsystem(s) are configured for determining one or more characteristics of the acquired one or more images and determining one or more characteristics of the first defect based on the one or more characteristics of the acquired one or more images.

Virtual inspection systems with multiple modes

Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying a defect detection algorithm to the images or the one or more characteristics of the images.

Image based specimen process control

Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori.

Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data

Noise induced by pattern-of-interest (POI) image registration and POI vicinity design patterns in intra-die inspection is reduced. POI are grouped into alignment groups by co-occurrence of proximate registration targets. The alignment groups are registered using the co-occurrence of proximate registration targets. Registration by voting is performed, which can measure a degree that each of the patterns-of-interest is an outlier. POI are grouped into at least one vicinity group with same vicinity design effects.

Reducing registration and design vicinity induced noise for intra-die inspection

Shape primitives are used for inspection of a semiconductor wafer or other workpiece. The shape primitives can define local topological and geometric properties of a design. One or more rules are applied to the shape primitives. The rules can indicate presence of a defect or the likelihood of a defect being present. A rule execution engine can search for an occurrence of the shape primitives covered by the at least one rule.

Shape based grouping

Methods and systems for identifying outliers in multiple instances of a pattern of interest (POI) are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a POI within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for determining a feature of each of the images generated at the multiple instances of the POI. In addition, the computer subsystem(s) are configured for identifying one or more outliers in the multiple instances of the POI based on the determined features.

Outlier detection on pattern of interest image populations

Methods and systems for adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology are provided. The embodiments provide image processing and pattern recognition algorithms and an adaptive sampling method for extracting critical areas from SEM image patches for use in a wafer inspection system when design data for a semiconductor chip is not available. The embodiments also provide image processing and pattern recognition algorithms for efficiently discovering critical defects and significant deviations in the normal manufacturing process, using the output from a wafer inspection system and an adaptive sampling method to select wafer locations to be examined on a high resolution review or metrology tool.

Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology

A source-address independent, multi-path routing method for use in a communication network is disclosed. A network node uses an information packet's destination address to determine a plurality of neighbors it has a proportional likelihood to forward that packet to, such that packets can be sent over multiple paths to a destination node without undesirable looping. Multiple-neighbor proportional forwarding routing tables are determined by computing a directed graph of multiple optimal paths to each destination node. Optimal paths and forwarding proportions are based on link capacities. The multi-path routing method provides maximized throughput, reduced congestion and superior load balancing over single-path routing. Source-address independence also overcomes a major problem of more traditional source-address dependent multi-path routing methods. The source-address independent, multi-path routing method can be implemented in mixed networks where some nodes do not implement the method. Data structures and methods for determining the optimal paths and parameters are provided.

Stream basis set division multiplexing

Multi-neighbor proportional forwarding in a network

Routing table for non-uniform random neighbor selection

Growing community of inventors

Fremont, CA, United States of America

Saibal Banerjee