Gigadevice Semiconductor (beijing) Inc.

Beijing Mks Research Institute

Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Beijing Xinmei Hutong Technology Co., Ltd.

Sai Zhang

Jiang Yi Liu

Jianjun Zhang

Hong Hu

Qingming Shu

Hui Zhou

Yingui Sun

Ronghua Pan

Shiguo Wang

Yang Xia

Liang Peng

Qiong Yang

Tong Wang

Quan Wen Zhang

Zengli Liu

Xinyue Zhang

Datao Zhang

Haipeng Li

Deyong Wang

Xintao Bao

Beifan Ma

Deguo He

Mianen Chen

Yunpeng Yan

Hui Elizabeth Zhou

The present invention relates to an rapid inflating/deflating device used for a protective clothing and a smart protective clothing, the inflating/deflating device including: an outer cylinder provided with a first hole; an inner cylinder provided in the outer cylinder and provided with a second hole and being capable of sliding between a first position in which the second hole is aligned with the first hole and a second position in which the second hole is deviated from the first hole and is closed by the inner wall of the outer cylinder; a blade provided in the inner cylinder and a motor driving the blade; a biasing device for biasing the inner cylinder toward the first position; wherein the inner cylinder further comprises a third opening on which an one-way valve is provided so as to allow pressurized gas to flow one-way.

Rapid inflating and discharging device for protective suit and intelligent multi-purpose protective suit comprising same

The present disclosure describes an emoji input method and a device thereof. The emoji input method may include: detecting a user operation that starts an emoji conversion function; receiving a plurality of user input words; segmenting the plurality of user input words to obtain a keyword candidate; searching for an emoji corresponding to the keyword candidate based on a mapping relationship between the keyword and emojis; and displaying the emoji.

Emoji input method and device thereof

The invention provides a shell including a left portion and a right portion which are able to switch between a translation open state in which they are separated from each other by a distance and a closed state in which they are closed with each other, wherein in the translation open state, the left portion and the right portion are able to pivot relative to each other, wherein the shell also includes a locking mechanism and a separation bias device, wherein the locking mechanism is configured to keep the shell in the closed state and is able to be released so as to allow the shell to be placed in the translation open state, and wherein the separation bias device is configured to bias the left portion and the right portion toward the translation open state.

Ski boots

The present disclosure provides a target mounting fixture, including: a target fixing frame for fixing a target, the target fixing frame including a hoisting portion; a target carrier detachably connected to the target fixing frame; and a moving unit connected to the target carrier for moving the target carrier to move the target.

Target mounting fixture

An enhanced Flash chip of SPI interface and a method for packaging chip, to solve the problems of high design complexity, long design period and high design cost. The chip comprises SPI FLASH and RPMC which are packaged integrally; the SPI FLASH and the RPMC comprise an independent controller, respectively; the same IO pins in SPI FLASH and RPMC are mutually connected and are connected to the same external sharing pin of the chip. The SPI FLASH and the RPMC further comprise an internal IO pin, respectively, in which the internal IO pin of SPI FLASH is connected with the internal IO pin of RPMC, and the internal mutual communication between the SPI FLASH and the RPMC is achieved through the mutually connected internal IO pins. Thus, it is possible to reduce the package size, decrease the cost of design, shorten design period and improve chip performance.

SPI interface enhanced flash chip and chip packaging method

An enhanced Flash chip and a method for packaging chip are provided to solve the problems of high design complexity. The enhanced Flash chip comprises: a FLASH and a RPMC packaged integrally, wherein the same IO pins in the FLASH and in the RPMC are mutually connected and are connected to the same external sharing pin of the chip; an external instruction is transmitted to the FLASH and the RPMC through the external sharing pin of the chip, and the controller of the FLASH and the controller of the RPMC respectively judge whether to execute the external instruction; and the FLASH and the RPMC further comprise internal IO pins, respectively, the internal IO pins of the FLASH and the internal IO pins of the RPMC are mutually connected, and internal mutual communication between the FLASH and the RPMC is performed through the pair of mutually connected internal IO pins.

Enhanced flash chip and method for packaging chip

An enhanced Flash chip and a method for packaging chip, wherein the enhanced Flash chip comprising: a FLASH and a RPMC, packaged integrally; the FLASH and the RPMC each comprising: a first internal IO pin and a second internal IO pin; the FLASH and the RPMC being further provided with a jumper window, one end of which is mutually connected to the first internal IO pin of the FLASH or the RPMC and the other end of which is mutually connected to the first internal IO pin of the RPMC or the FLASH; the second internal IO pin of the FLASH and the second internal IO pin of the RPMC being mutually connected. The enhanced Flash chip provided in the present application may effectively reduce design complexity and chip manufacturing cost, avoid the crossing of the metal lead wires in the chip package, and increase the yield of chip packages.

Growing community of inventors

Beijing, China

Sai Zhang