Lg Innotek Co., Ltd.

Sai Ran Eom

Chang Hwa Park

Seol Hee Lim

Yun Kyoung Jo

Ae Rim Kim

Hyuk Soo Lee

Sung Won Lee

Sung Wuk Ryu

Jae Bong Choi

Hyun Aee Chun

The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

Printed circuit board for memory card

Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.

Printed circuit board and method of manufacturing the same

The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof

Growing community of inventors

Seoul, South Korea

Sai Ran Eom