Asm Assembly Automation Limited

Asm Technology Singapore Pte Ltd

Sai Kit Wong

Pei Wei Tsai

Ka Yee Mak

Gary Peter Widdowson

Chak Tong Albert Sze

Chak Tong Sze

Ching Man Stanley Tsui

Wai Hong Sizto

Shun Yan Lee

Fong Shing Yip

Xiao Lan Liu

Shing Kai Yip

Chi Wah Yuen

Jian Jun Ju

A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.

Testing of LED devices during pick and place operations

Method of generating a correction function for a light-emitting diode (LED) testing process, including: detecting light emitted by a reference LED and reflected from inactive LEDs on a panel within a field of view of a detector; varying a number of the inactive LEDs to derive uncorrected values of an optical parameter as a function of the number of inactive LEDs; detecting light emitted by the reference LED, or by an active LED having identical optical properties, in the absence of any other LEDs, to determine at least one reference value for each optical parameter; and calculating differences between the uncorrected values and each reference value to generate the correction function, the correction function being based on the number of inactive LEDs which are arranged within the field of view of the detector in the light detecting step.

LED testing process and correction methods therefor

A sorting system is provided for electronic components such as LED devices which includes a testing station for testing and determining a characteristic of each electronic component. A first tray has a plurality of receptacles for receiving tested electronic components and a second tray has more receptacles than the first tray for receiving tested electronic components. Electronic components comprising tested characteristics that occur with greater frequency are loaded into the receptacles of the first tray and electronic components comprising tested characteristics that occur with lower frequency are loaded into the receptacles of the second tray.

System for testing and sorting electronic components

A test handler is provided for testing electronic devices having light-emitting elements. Electronic devices are mounted at a loading position, optical measurements are conducted at a test contact position where a testing device is located for optical communication with the light-emitting elements and then tested electronic devices are removed at an unloading position. Multiple test contactors hold the electronic devices and move them to and through the loading position, test contact position and unloading position in sequence. Each test contactor comprises a device contact point including electrical conductors which are connected to electrical contacts of the electronic device when the electronic device is mounted at the device contact point, and a retaining mechanism grips the electronic device at the device contact point such that the retaining mechanism does not obstruct the optical communication between the testing device and the light-emitting element at the test contact position.

Test handler including gripper-type test contactor

The invention provides a temperature monitoring system for a semiconductor test handler. A preparation stage brings a test device to a predetermined temperature for testing at a test platform at said predetermined temperature. At least one radiation sensor, such as a thermopile device, is employed in the test handler for detecting a surface temperature of the test device by measuring radiation emitted from the test device.

Test handler temperature monitoring system

Growing community of inventors

Hong Kong, China

Sai Kit Wong