Apple Inc.

Sai Feng Liu

Erik G De Jong

Dale N Memering

Jing Jing Zhang

Palaniappan Chinnakaruppan

Srikanth Kamireddi

Sawako Kamei

Jeffrey C Mylvaganam

Feng Min

Xiang Du

Xiao Bing Cai

Jong Kong Lee

A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

Sapphire cover for electronic devices

Growing community of inventors

Shenzhen, China

Sai Feng Liu