Kyocera Corporation

Saeki Nakamura

Kazuo Watada

Koji Enokida

Yoichi Fujioka

Hiroko Tanda

A composite resin and fillers for molding electronic and structural parts that have high dimensional accuracy, are free of surface defects stemming from the mold and are suitable for mass production. The preferred composite contains 10 to 70 vol-% of a thermosetting resin with the balance consisting of filler particles having an average diameter of 40 &mgr;m or less. The final molded article has pores of 15 to 80 &mgr;m in diameter occupying between 3 and 30% of the area of a cross-section.

Resin composite and process for producing the same

The present invention relates to a composite of resin and fillers used in electronic parts and structural parts, and to a process for producing the same, and the object of the present invention is to provide a resin composite with a molded body having high dimensional accuracy, being free of surface defects attributable to a mold used for molding and being capable of easy forming and mass production, as well as a process for producing the same. The process for producing a resin composite according to the present invention comprises a step of mixing fillers of an average particle diameter of 40 .mu.m or less with thermosetting resin, a step of compression molding this mixed powder into a predetermined shape at ordinary temperature, and a step of allowing the compression molded body after released from the mold to be hardened by heating at 100 to 250.degree. C. to give a hardened molded body.

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Sendai, Japan

Saeki Nakamura