Silicon Valley Group, Inc.

Asml Us, Inc.

Beijing Sevenstar Electronics Co., Ltd.

Saeed Sedehi

Christopher T Ratliff

Morteza Yadollahi

Taiqing Qiu

Jeff Kowalski

Arsalan Emami

Mitch Agamohamadi

Arsalan Alan Emami

An embodiment of the present invention is a technique to automate transfer of parts for high throughput. A boat transfer unit (BTU) arm carrying a boat containing a plurality of parts is rotated from an initial position to a first position that is below a process chamber. The BTU arm engages a boat support that supports the boat. The BTU arm is moved upward to a second position such that the boat partially enters the process chamber at a distance D with respect to an entrance opening of the process chamber. An elevator arm carrying a pedestal is engaged to lower side of the boat support. The BTU arm is moved away from the second position. The elevator arm is moved upward to fully insert the boat inside the process chamber.

Automation for high throughput semiconductor batch-wafer processing equipment

An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.

Hot wall rapid thermal processor

Growing community of inventors

Orange, CA, United States of America

Saeed Sedehi