Micron Technology Incorporated

Saeed Momenpour

Steven J Brunelle

A testing apparatus, system and method for testing computer memory modules are disclosed. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.

Methods of testing memory devices

An adapter and method for aligning and connecting the external leads of at least one integrated circuit device to conductors on a substrate of a multi-chip module. The adapter includes a component frame configured to receive the integrated circuit device. The component frame is attached to a support member. The support member with attached component frame is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit device are aligned with corresponding conductors on the multi-chip module substrate. A second support member, which may also have a component frame attached thereto, is placed over the opposing side of the multi-chip module substrate. The ends of the first support member are attached to the ends of the second support member such that the external leads of the IC device are forced into electrical contact with the corresponding conductors on the multi-chip module substrate.

Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same

Motherboard memory slot ribbon cable and apparatus

An adapter and method for aligning and non-permanently connecting the external leads of a plurality of integrated circuit devices to conductors on a substrate of a multi-chip module. The adapter includes a plurality of component frames, each component frame being configured to receive at least one integrated circuit device. The plurality of component frames is attached to at least one support member. The support member with attached component frames is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit devices are aligned with corresponding conductors on the multi-chip module substrate. A second support member, which may also have component frames attached thereto, is placed over the opposing side of the multi-chip module substrate. The ends of the first support member are attached to the ends of the second support member such that the external leads of the plurality of IC devices are forced into electrical contact with the corresponding conductors on the multi-chip module substrate.

A testing apparatus system and method for testing computer memory modules. The apparatus includes a motherboard having a processor and at least one resident memory socket fixed to the motherboard. A remote memory socket is provided and located a distance from the resident memory socket, such as on a periphery of the motherboard. The remote memory socket is coupled to the resident memory socket by a conductor assembly such as a ribbon cable and an adapter. A memory module is placed in the remote memory socket and tested using a signal or combination of signals from the processor. A plurality of motherboards, each being configured with remote memory sockets, may be combined to form a testing system suitable for use with an automated handler.

A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.

Reversed memory module socket and motherboard incorporating same

A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module is disclosed. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing the memory modules in multimotherboard test systems is also described. The invention further includes a method of converting a conventional motherboard and memory socket assembly for such testing.

Reversed memory module socket, motherboard and test system including same, and method of modifying motherboard

An adapter and method for aligning and non-permanently connecting the external leads of a plurality of integrated circuit devices to conductors on a substrate of a multi-chip module. The adapter includes a plurality of component frames, each component frame being configured to receive at least one integrated circuit device. The plurality of component frames is attached to at least one support rod. The support rod with attached component frames is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit devices are aligned with corresponding conductors on the multi-chip module substrate. A second support rod, which may also have component frames attached thereto, is placed over the opposing side of the multi-chip module substrate. The ends of the first support rod are attached to the ends of the second support rod such that the external leads of the plurality of IC devices are forced into electrical contact with the corresponding conductors on the multi-chip module substrate.

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Nampa, ID, United States of America

Saeed Momenpour