Canon Kabushiki Kaisha

Sadayoshi Sakuma

Hirokazu Komuro

Yuzuru Ishida

Kenji Takahashi

Takuya Hatsui

Ichiro Saito

Nobuyuki Hirayama

Souta Takeuchi

Satoshi Ibe

Maki Kato

Makoto Sakurai

Norihiro Yoshinari

Shuichi Tamatsukuri

Mineo Shimotsusa

Ryo Kasai

Nobuyuki Suzuki

Takahiro Matsui

Masataka Sakurai

Tatsuhito Goden

Kengo Umeda

Kazuaki Shibata

Makoto Takagi

Soichiro Nagamochi

Hidenori Yamato

Yohei Osuki

Toru Eto

Shinya Iwahashi

Yoshinori Misumi

Hideo Kanno

Masaya Uyama

Toshio Negishi

Shimpei Otaka

Takeru Yasuda

Hiroto Komiyama

Keisuke Kishimoto

Yasuhiro Soeda

A device, comprising a plurality of units arrayed in a predetermined direction, a first terminal configured to supply a voltage to the plurality of units, and a second terminal configured to supply a voltage to the plurality of units, wherein the plurality of units include a first unit including a memory element arranged between the first terminal and the second terminal, and a first transistor configured to perform write to the memory element, and a second unit including a second transistor arranged between the first terminal and the second terminal in correspondence with the first transistor of the first unit.

Semiconductor device, liquid discharge head, and liquid discharge apparatus

An element substrate comprises: a first insulation layer between a heater layer where plural heaters are formed, and a first wiring layer; and a second wiring layer formed within the first insulation layer, where an individual wiring connected to each heater is formed; a first metal plug that fills an interior of a first through-hole penetrating from the heater layer to the second wiring layer; and a second metal plug, provided in a place different from a place where the first through-hole is formed, that fills an interior of a second through-hole penetrating from the second wiring layer to the first wiring layer. Each heater is connected to the second wiring layer via the first metal plug, and the second wiring layer is connected to the first wiring layer via the second metal plug.

Element substrate, liquid discharge head, and printing apparatus

To suppress the progress of metal dissolution by ink when wire break of a wiring to a heater occurs, in an element substrate, according to the present invention, for example, which is used in an inkjet printhead, each of heaters integrated in the element substrate is connected to an individual wiring via a first through-hole penetrating an insulation layer, and further connected to a common wiring from the individual wiring via a wiring formed in another wiring layer via a second through-hole penetrating an insulation layer. The individual wiring and the common wiring are formed in the same wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole.

A liquid ejection head and its manufacturing method are capable of reducing the thickness of a protective layer as compared to the traditional technique so as to efficiently transfer the heat energy generated by a heating resistance element to a droplet of liquid such as ink. To achieve this, power supply wirings are provided in the same layer below the heating resistance element.

Liquid ejection head, method for producing liquid ejection head, and liquid ejection apparatus

An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

Element substrate and liquid ejection head

Provided is an element substrate with suppressed variations in resistance though having a high resistance. In an element substrate equipped with a heat generating resistor that generates thermal energy for ejecting a liquid, the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer and a second resistor layer containing a metal silicon nitride and the first resistor layer and the second resistor layer are different from each other in at least one of a silicon content in the metal silicon oxide and a metal element contained in the metal silicon nitride.

Element substrate

On an element substrate having a multilayered structure in which a temperature detection element is provided in an intermediate layer of a wiring layer and a print element layer, a wiring layer and a temperature detection element formed on the first interlayer insulation film are connected by a first conductive plug which penetrates through the first interlayer insulation film. In addition, a wiring layer and a print element which are formed on the second interlayer insulation film formed on the first interlayer insulation film are connected by a second conductive plug which penetrates through the first and second interlayer insulation films. By manufacturing the element substrate by this arrangement, the thickness of an interlayer insulation film between a print element and a temperature detection element can be made thin, and the sensitivity of the temperature detection element can be improved.

Element substrate, manufacturing method thereof, printhead, and printing apparatus

A reproduction method of a liquid ejecting head including: a process of filling the flow path with an electrolyte solution containing metal, and filling a space between an electrode capable of applying a voltage to between itself and the upper protective film and the upper protective film with the electrolyte solution; and a process of applying a voltage to between the upper protective film and the electrode to make the metal contained in the electrolyte solution deposit on the surface of the upper protective film.

Reproduction method of liquid ejecting head

A method of manufacturing a liquid ejection head includes forming, on the substrate, a metal layer formed of a first metal, forming a liquid flow path pattern formed of a second metal that is a metal of a different kind from that of the first metal and that is dissolvable in a solution that does not dissolve the first metal, the liquid flow path pattern being formed on at least a part of a surface of the metal layer, covering the metal layer and the pattern with an inorganic material layer to be formed as the nozzle layer, forming the ejection orifices in the inorganic material layer, and removing the pattern by the solution. A standard electrode potential Eof the first metal and a standard electrode potential Eof the second metal have a relationship of E&#x3e;E

Method of manufacturing liquid ejection head

An inkjet printhead substrate includes a base plate, a heat storage layer placed on the base plate, a heat-generating resistive layer which is placed on the heat storage layer and which includes an electrothermal transducing portion, a wiring layer electrically connected to the heat-generating resistive layer, and an insulating protective layer covering the heat-generating resistive layer and the wiring layer. The heat storage layer includes a porous cyclic silazane film formed by a vapor phase process.

Inkjet printhead substrate, method of manufacturing the same, and inkjet printhead

An ink jet recording head substrate is provided which includes a base substrate, a heat accumulation layer overlying the base substrate, a heating resistor layer including an electrothermal conversion portion and overlying the heat accumulation layer, a wiring layer electrically connected to the heating resistor layer, and an insulating protective layer covering the heating resistor layer and the wiring layer. The heat accumulation layer includes a porous cyclic siloxane film.

Ink jet recording head substrate, method for manufacturing the same, and ink jet recording head

In a liquid ejection head for ejecting liquid by using thermal energy, reduction of film thickness caused by elution of a protective layer when kogation on the protective layer is removed is made uniform and decrease in liquid ejection performance is suppressed. More specifically, a counter electrode is provided around a portion on which an ejection port of a flow path forming member is formed.

Liquid ejection head and liquid ejection apparatus

Provided is a method for manufacturing a substrate for liquid ejection head including an ejection energy generating element and a nozzle layer including an ejection port and a liquid channel. The method includes the steps of: forming, on the substrate including the element, a metal mold member made of metal and having a flat surface, the metal mold member making up at least a part of a mold for the liquid channel, and a planarization layer made of the metal and having a flat surface to planarize a surface of the nozzle layer; coating the mold for the liquid channel and the planarization layer with negative-type photosensitive resin, thus forming a negative-type photosensitive resin layer to be the nozzle layer; exposing the resin layer to ultraviolet rays, thus forming the ejection port; and selectively removing the mold for the liquid channel, thus forming the liquid channel.

Manufacturing method of substrate for liquid ejection head

A recording-element substrate includes an ejection port configured to eject liquid; a heating resistance element configured to generate thermal energy for ejecting the liquid from the ejection port; and a drive circuit configured to drive the heating resistance element. The heating resistance element includes a heating resistor layer and three pairs of electrodes provided for the heating resistor layer. The drive circuit forms a heating area that generates thermal energy in the heating resistor layer by selectively using two or more of the electrodes.

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Yokohama, Japan

Sadayoshi Sakuma