Futaba Corporation

Futaba Denshi Kogyo K.k.

Sadao Takano

Kenichi Honda

Toshihide Hirayama

Akihiro Azeta

Yoshio Makita

Akihiro Mihira

Yusuke Yasuoka

Keita Abe

A fluorescent display device includes a housing having with a glass substrate and a circuit board adhered to the inner surface of the glass substrate of the housing. The circuit board includes an anode formed of multiple anode conductors, control elements for controlling the anode conductors and a phosphor layer formed on the anode conductors. The fluorescent display further includes an electron source formed above the anode in the housing, from which electrons are bombarded to the phosphor layer corresponding to the anode conductors selected by the control elements so that a desired display can be obtained. An aluminum thin film with the aluminum area ratio within a range from 30 to 60% is formed on the inner surface of the glass substrate and the circuit board is fixed to the aluminum thin film via a die-bond material.

Fluorescent display device and manufacturing method therefor

An active matrix drive fluorescent display device capable of preventing misluminescence of phosphor layers. A semiconductor chip which includes a plurality of luminous dots arranged in a matrix-like manner and is arranged in an envelope is covered on a cut surface thereof rendered electrically GND with an insulating cover layer. Such construction eliminates a failure in insulation between electrodes arranged on the semiconductor chip, to thereby prevent misluminescence of the luminous dots, leading to an increase in display quality.

Active matrix drive fluorescent display device and method for manufacturing same

A method for processing a single-crystal semiconductor wafer is provided which is capable of minimizing a dead space to maximize the number of elements per one wafer and preventing leakage luminescence and a reduction in luminance. A phosphor is deposited on each of a plurality of regions defined in the wafer at predetermined intervals and a water-resistant protective film is formed on the phosphor. Then, the wafer is cut for every one of the regions by means of a dicing saw using cutting water, to thereby provide a plurality of chips. The chips are subject to calcination during a calcination step in manufacture of fluorescent display device in which the chips are used as a display section, resulting in the protective film being evaporated.

Method for processing single-crystal semiconductor wafer for fluorescent

Growing community of inventors

Chiba-ken, Japan

Sadao Takano