Mitsubishi Electric Corporation

Sadao Sato

Teruhiko Kumada

Hiroyuki Osuga

Tsuyoshi Ozaki

Sohei Samejima

Shigeru Utsumi

Souhei Samejima

An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs () and () being cured after each covering the surfaces of a metal plate () provided with first throughholes () therein and the inner walls of the first throughholes (); prepregs () and () being cured after glass clothes () and () are sandwiched between the prepregs () and (), and the prepregs () and (), respectively; and second throughholes () that connect wiring layers () and (), and () and () provided on both surfaces of prepregs () and (), respectively. The prepregs () and () and the prepregs () and () are characterized in that they contain inorganic filler. Furthermore, the prepregs () and () and the prepregs () and () may contain elastomer.

Printed circuit board and method of manufacturing the same

A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through hole for electrically connecting upper and lower signal interconnections via the secondary through hole. A coating layer coats an outer peripheral edge of the CFRP core as seen in a plan view. Thereby, a printed interconnection board with low thermal expansivity and high thermal conductivity capable of preventing exfoliation of a CFRP layer on a side surface of a substrate using CFRP as a core, as well as preventing falling-off of carbon powders from the CFRP layer, and a method of manufacturing the same can be obtained.

Printed interconnection board having a core including carbon fiber reinforced plastic

Growing community of inventors

Chiyoda-ku, Japan

Sadao Sato