Taisei Corporation

Other

Tokyo Electron Limited

Mitsui Toatsu Chemicals, Incorporated

Hitachi Cable, Inc.

Mitsui Toatsu Kagaku Kabushiki Kaisha (mitsui Toatsu Chem., Inc.)

Panasonic Corporation

Tohoku University

Nichias Co., Ltd.

Kondoh Industries, Ltd.

Cambridge Filter Japan, Ltd.

Nissan Motor Co., Ltd., No. 2

Sadao Kobayashi

Yoshihide Wakayama

Masayuki Imafuku

Osamu Suenaga

Misako Saito

Naoki Mori

Nobuhiro Fukuda

Tadahiro Ohmi

Hiroyuki Ito

Yasuyuki Shirai

Teruyuki Hayashi

Takenobu Matsuo

Atsuhiko Nitta

Kiyoshi Watanabe

Tsuyoshi Wakabayashi

Isao Terada

Hiroshi Sukawa

Naoya Hirayama

Hiromu Itoh

Sadaaki Yamamoto

Makoto Yamamoto

Hiroshi Itoh

Kazuo Saito

Koji Suzuki

Tomio Tanaka

Kazutaka Uekado

Takakazu Yamamoto

Hiroshi Ozawa

Hitoshi Inaba

Kazuki Abe

Hideo Kamio

Nobuki Kobayashi

Kaoru Fujihara

Toshimi Nakagawa

Kenji Miyachi

Yutaka Ohashi

Haruo Sekiguchi

Yuji Matumura

Hideo Hanaoka

Seiichi Takizawa

Toshihisa Okabe

Kikuji Kobayashi

Hiromu Ito

Hisayuki Yamamoto

Yoji Kawahara

Hidemi Takenouchi

Takayuki Teramoto

Yasuo Okita

Kazufuyu Sudoh

Satoki Sugiyama

Takahiro Ouchi

Tamotu Uejima

Takeshi Yamada

Ryosuke Enoshita

Keiji Matsuno

Kazuo Yamamoto

Takashi Taniguchi

Minoru Tanaka

A heating device includes a heat resisting vacuum insulator () wound around the outer periphery of an electric heater () disposed along the outer wall of an exhaust pipe (), wherein the electric heater () has a resistance heating element and a heat resisting electric insulator covering this resistance heating element, and the heat resisting vacuum insulator () includes a hollow platy covering material air-tightly sealed thereinside by a metal seat () having a heat resisting temperature of at least 100&#xb0; C., and a fibrous or granular filling material () filled in the hollow portion of this covering material and having a heat resisting temperature of at least 100&#xb0; C., the inside of the covering material being kept in a vacuum state.

Heat resisting vacuum insulating material and heating device

An electric wire with coating of polyvinyl chloride family resin composition is disclosed which has a coating layer containing a polyvinyl chloride family resin composition comprising polyvinyl chloride family resin and one or more compounds selected from calcium soap, zinc soap and hydrotalcite. The polyvinyl chloride composition does not comprise either or both of a lead compound and a &#x3b2;-diketone compound having a melting point less than 100&#xb0; C. A plasticizer can be further added to the composition so as to obtain a heat-stable vinyl chloride composition. A cable covered with the polyvinyl chloride family resin composition is also disclosed, including a cable having electric wires coated with the polyvinyl chloride family resin composition.

Electric wire and cable with coating/covering of polyvinyl chloride family resin composition

A method of cleaning air, including a humidifying operation for humidifying the air containing chemical contaminants by a humidifier and taking a part of the gaseous contaminants in the air into excessive moisture to remove the contaminants from the air, and a dehumidifying operation for dehumidifying the humidified air by a condenser and taking the gaseous chemical contaminants remaining, without being removed, in the humidifying operation into condensed water for removal. By using an oblique honeycomb having both front and rear faces and both upper and lower faces disposed in open state, air is led from the front opening part of the oblique honeycomb and water is fed from the upper opening part thereof to one or both of the humidifier and condenser.

Method and device for cleaning air

A material not releasing gaseous organic substances during use is used as a filter medium and a sealing material for tightly sealing between the medium and a frame. Specifically, a synthetic paraffin not containing an aliphatic hydrocarbon having not more than 19 carbon atoms or less is used as a non-silicone type water repellent contained in a treatment agent for forming fibers into a cloth-like filter medium. A carboxylic acid ester having 400 or more molecular weight is used as a plasticizer and a phenolic compound having 300 or more molecular weight is used as an antioxidant to be added to the treatment agent and the sealing material. This enables that the gaseous organic substances are not present in a clean room, a semiconductor production apparatus or the like. Further, if the filter medium and the sealing material are formed of a material not releasing organic phosphorus compounds and boron compounds in the air, a clean room and a local facility particularly suitable for use in the production of semiconductors are provided.

Air filter, method of manufacturing air filter, local facility, clean room, treating agent, and method of manufacturing filter medium

The present invention has as its object to provide an air filter not only for trapping suspended particulate substances but also for not generating hazardous contaminates in the air, which cause trouble in the manufacture of semiconductor devices. As a binder to bind fibers of the air filter together, a polymer dispersion is used in which a copolymer of a hydrophilic monomer and a hydrophobic monomer is dispersed in water. As an initiator for polymerization of the copolymer, an organic peroxide is used. When an air filter () is installed downstream of a chemical filter (), the space () placed downstream of the air filter () is made substantially free of organic substances and/or inorganic substances that cause trouble in the manufacture of semiconductor devices.

Filter medium for air filter and process for producing the same

An electric wire with coating of polyvinyl chloride family resin composition is characterized by having a coating layer including polyvinyl chloride family composition obtained from adding more than one of any calcium soap, zinc soap and hydrotalcite to resin including polyvinyl chloride resin as a main constituent, and further adding thereto plasticizer so as to obtain a heat-stable vinyl chloride composition, and further adding thereto as stabilization auxiliaries high-melting-point &#x3b2;-diketone compound having a melting point more than 100&#xb0; C. out of &#x3b2;-diketone compounds expressed by a general formula of R.CO.CH2.CO.R'.

Electric wire coated with polyvinyl chloride resin composition and cable

A semiconductor manufacturing facility has a proper strength and an anti-vibration effect. The semiconductor facility contains processing apparatuses, installation tables and an installation floor. An apparatus having a vibration source is installed on an installation table having a rigid structure. The installation table is installed on the installation floor having a floor construction including a plurality of columns, which support a floor member extending in horizontal directions. An interval of the columns is 4 m to 12 m.

Semiconductor manufacturing facility and a semiconductor manufacturing method

An air-supply machine cleans outside air. The cleaned outside air is dehumidified by cooling by performing heat exchange between the cleaned outside air and an exhaust air from a lithography apparatus by a first heat-pipe. The dehumidified outside air is heated by performing heat treatment between the dehumidified outside air and an exhaust air from a vertical heat treatment apparatus by a second heat-pipe. The heated outside air is supplied to inside the housing of the vertical heat treatment apparatus. Thereby, the consumption of air in the clean room is reduced and the running cost of the clean room is reduced.

Device and method for feeding treating air

An amount of energy consumption in a semiconductor fabrication facility can be reduced by using cooling water drained from a semiconductor fabrication apparatus as a heat source of another semiconductor fabrication apparatus. Cooling water of 80&deg; C. drained from a heating furnace of a heat processing apparatus ( ) is supplied to a deionized water heating apparatus ( ) of a cleaning apparatus ( ). The deionized water heating apparatus ( ) raises a temperature of deionized water of a room temperature to 60&deg; C. through heat exchange with the cooling water of 80&deg; C. The cooling water, whose temperature falls to 30&deg; C. after the heat exchange, is reutilized for cooling of the heating furnace ( ).

System and method for utilization of waste heat of semiconductor equipment and heat exchanger used for utilization of waste heat of semiconductor equipment

An air cooling device includes at least one cooling unit which includes an oblique honeycomb having front, rear, upper, and lower openings and disposed so that air to be cooled is introduced into the front opening and cooled air is discharged from the rear opening, a cooling water supply means which supplies cooling water to the upper opening of the oblique honeycomb, and a water receiving section which receives discharge water discharged from the lower opening of the oblique honeycomb, and a blower means which introduces air to be cooled into the front opening of the oblique honeycomb and allows cooled air to be discharged from the rear opening of the oblique honeycomb, wherein the height of one oblique honeycomb in the cooling unit is 200 to 800 mm. The air cooling device has high thermal efficiency, a small liquid-gas ratio, and a small pressure drop, and is capable of saving space and energy.

Air cooling device and air cooling method

Materials not releasing gaseous organic materials during use are used as a dry-type sealing material such as a gasket disposed upon mounting an air filter to an opening of a ceiling or the like, a wet-type sealing material filled and used in a gap for connecting wall materials or partitionings, a vinyl chloride sheet or a vinyl chloride cloth as a facing material for walls and floors. Specifically, a carboxylic acid ester having a molecular weight of not less than 400 is used as a plasticizer, a phenolic compound having a molecular weight of not less 300 is used as an antioxidant, an aliphatic hydrocarbon having not less than 19 carbon atoms (for example, microcrystalline wax) is used as a lubricant, and an alkylamine ethylene oxide adduct having a molecular weight of not less than 350 is used as an antistatic agent.

Wet sealing materials and building components useful for clean rooms and local facilities

A heat exchange section ( ) is provided in the middle of a circulation water path ( ) connecting between a temperature-controlled water tank ( ) and a semiconductor manufacturing apparatus body ( ) so as to perform a heat exchange with air of a clean room ( ). The heat exchange section ( ) is installed near an exit of an air circulation path ( ) above a fan-filter unit ( ) of the clean room as a temperature stabilized area off an atmosphere of the clean room ( ). Additionally, as another method, a temperature of a chemical fluid from a chemical fluid tank ( ) is controlled to be a temperature of the air in the clean room by a heat exchange section ( ) provided in a location the same as above without using the temperature-controlled water so as to supply the chemical fluid to the semiconductor manufacturing apparatus body ( ).

Device and method for manufacturing semiconductor

A semiconductor manufacturing facility is provided, which can reduce a thermal load in a clean room and reduce an amount of energy thereof. Semiconductor manufacturing equipment, which generates heat when it is used, is installed in the clean room and is covered by a housing. The housing is configured to be capable of introducing the air inside the clean room into an interior thereof. The air inside the housing is exhausted outside the clean room through a plurality of exhaust passage members. A heat insulating material is associated with the housing to reduce the release of heat from the housing to the air inside the clean room. A space between the housing and the semiconductor manufacturing equipment may be hermetically sealed, and an air introducing member may be connected to the housing to take air outside the clean room into the hermetically sealed space.

Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method

Air filter

A heat generating part ( ) of semiconductor manufacturing equipment is cooled by cooling water. An inner fluid passage ( ) having an inlet port ( ) of the cooling water on a vertically lower portion thereof is formed so as to surround a periphery of the heat generating part ( ). An outer fluid passage ( ) having an outlet port ( ) of the cooling water on a vertically upper portion thereof is formed so as to surround a periphery of the inner fluid passage ( ) and be capable of exchanging heat with the cooling water in the inner fluid passage. A communication passage ( ) is provided to connect a vertically upper portion of said inner fluid passage and a vertically lower portion of said outer fluid passage. The cooling water flowing out of the outlet port ( ) of the outer fluid passage ( ) is supplied to the inlet port ( ) of the inner fluid passage ( ).

Growing community of inventors

Tokyo, Japan

Sadao Kobayashi