Nec Tokin Corporation

Nec Toppan Circuit Solutions, Inc.

Airex Corporation

Sadamu Toita

Satoshi Arai

Yoshihiko Saiki

Takayuki Inoi

Katsuhiro Yoshida

Takeshi Saito

Masahiko Takahashi

Naoki Wako

Hirofumi Nakamura

Koji Sakata

Masanori Takahashi

Yuji Yoshida

Ryuta Kobayakawa

Takeo Kasuga

Yutaka Akimoto

Eiji Matsunaga

Setsuo Noguchi

Kohtaroh Takahashi

A solid electrolytic capacitor includes a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA); dissolving a predetermined dissolved substance in a non-aqueous solvent, the predetermined dissolved substance being selected from the group consisting of boric acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 1,3,6-naphthalenetrisulfonic acid, and polystyrenesulfonic acid, and a salt thereof; mixing the dissolved solvent with pure water to obtain an additive solution; adding the additive solution into the first polymer solution to obtain a second polymer solution; and applying the second polymer solution to the inner conductive polymer film.

Solid electrolytic capacitor and forming method for the same

A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Solid electrolytic capacitor, transmission-line device, method of producing the same, and composite electronic component using the same

On a surface-roughened aluminum foil, an aluminum oxide film as an anodic oxide film is formed. Then, a conductive polymer layer as a solid electrolyte is formed thereon and thereafter a first metal plating layer is directly formed on the conductive polymer layer, thereby forming a cathode portion. On the other hand, a second metal plating layer is formed on another portion of the surface-roughened aluminum foil, which is not subjected to anodic oxidation or which is subjected to anodic oxidation followed by polishing or formation of an anode deposition film, to thereby form an anode portion. Third metal plating layers are formed at the anode and the cathode portions to obtain a capacitor element. A plurality of capacitor elements are stacked and bonded together fusion after formation of the third metal plating layers. Alternatively the capacitor elements may be bonded together by conductive paste without the third metal layers.

Solid electrolytic capacitor, stacked capacitor using the same, and fabrication method thereof

A sheet-shaped capacitor for storing electrical charges of large capacities, and to assure facilitated manufacture, cost reduction and improved reliability, and a method for manufacturing the capacitor. The capacitor includes a dielectric film, formed on a first major surface of a metal plate, an electrically conductive high polymer layer, formed on a first major surface of the dielectric film, and an electrically conductive layerformed on a first major surface of the electrically conductive high polymer layer, such as by copper plating. A cathode electrodeis led out from the electrically conductive layeron the side electrically conductive high polymer layer

Sheet-shaped capacitor and method for manufacture thereof

A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

Printed circuit board and manufacturing method thereof

On a surface-roughened aluminum foil, an aluminum oxide film as an anodic oxide film is formed. Then, a conductive polymer layer as a solid electrolyte is formed thereon and thereafter a first metal plating layer is directly formed on the conductive polymer layer, thereby forming a cathode portion. On the other hand, a second metal plating layer is formed on another portion of the surface-roughened aluminum foil, which is not subjected to anodic oxidation or which is subjected to anodic oxidation followed by polishing or formation of an anode deposition film, to thereby form an anode portion. Third metal plating layers are formed at the anode and the cathode portions to obtain a capacitor element. A plurality of capacitor elements are stacked and bonded together by fusion after formation of the third metal plating layers. Alternatively, the capacitor elements may be bonded together by a conductive paste without the third metal layers.

In an electronic circuit having an integrated circuit () having a power supply terminal, a noise filter disposed adjacent to the integrated circuit, and a printed board () having a pattern for supplying a power supply to the power supply terminals of the integrated circuit through the noise filter, the noise filter consists of a transmission line type noise filter () for removing noises having a wide frequency band.

Electronic circuit with transmission line type noise filter

An external cathode terminal () is adhered to one surface of a capacitor element while a prepreg () is adhered to another surface of the capacitor element. A reinforcement plate () is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (A,B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.

Thin surface mounted type solid electrolytic capacitor

A transmission line type noise filter, which is connectable between a direct current power supply and an electrical load component to pass a coming DC current while attenuating a coming AC current, includes a first conductor, a dielectric layer, a second conductor as a cathode, a first anode (), and a second anode. The first and the second conductors and the dielectric layer serve as a capacitance forming portion. The thickness of the first conductor is selected to substantially restrict temperature elevation of the first conductor, which is caused by DC direct current flowing in the first conductor.

Transmission line type noise filter with reduced heat generation even when large DC current flows therein

In a laminated solid electrolytic capacitor including a plurality of solid electrolytic capacitor elements, first end regions of anode bodies of the solid electrolytic capacitor elements adjacent to each other are mechanically connected to each other through a spacer. First end surfaces of the anode bodies of the solid electrolytic capacitor elements adjacent to each other are electrically connected to each other through an electrically conductive member.

Laminated solid electrolytic capacitor and laminated transmission line device increased in element laminating number without deterioration of elements

In a stacked solid electrolytic capacitor or a stacked transmission line element, anode portions of adjacent elements are electrically and mechanically connected to each other by the use of connecting members each in the form of a conductive adhesive or solderable metal, via metal plates connected to the anode portions so as to sandwich therebetween the anode portions, respectively, from the upper and lower surfaces thereof. On the other hand, cathode portions of the adjacent elements are electrically and mechanically connected to each other by a conductive adhesive, or are electrically and mechanically connected to each other by the use of adhesive insulating sheets each having a hollowed portion and a conductive adhesive filled in the hollowed portions, or are adhered to each other by adhesive insulating sheets, then electrically connected to each other by a conductive adhesive applied onto side surfaces of the cathode portions.

Stacked solid electrolytic capacitor and stacked transmission line element

A noise filter () has a first impedance element () having an impedance value Z, a second impedance element () having an impedance value Z, a third impedance element () having an impedance value Z, a first anode terminal (), a second anode terminal (), and a cathode terminal (). Z&#x3c;Zand Z&#x3c;Zare satisfied. Both ends of a central conductor () of the first impedance element () are connected to a first node () and a second node (), respectively. Both ends of the second impedance element () are connected to the first node () and the first anode terminal (), respectively. Both ends of the third impedance element () are connected to the second anode terminal () and the second node (), respectively. The central conductor () and a cathode conductor () of the first impedance element () form a transmission line structure having the impedance value Z. The cathode conductor () is connected to the cathode terminal ().

Transmission line type noise filter with small size and simple structure, having excellent noise removing characteristic over wide band including high frequency band

The invention provides a solid electrolytic capacitor of a configuration having a metal plated layer in a cathode part in order to prevent a decrease in the conductivity by oxidation of a conductive polymer and to realize a high reliability. Also there is provided a configuration in which a cathode part of the solid electrolytic capacitor includes a first metal plated layer and a solderable second metal layer.

Solid electrolytic capacitor

A transmission line type noise filter includes a metal fine wire ( ) made of valve-operational metal and serving as a central conductor, a capacitance forming portion ( ) formed over a predetermined length on the periphery of the metal fine wire, and a conductor layer ( ) formed on the surface of the capacitance forming portion and serving as an external conductor. The capacitance forming portion ( ) includes a sintered body ( ) formed on the metal fine wire and made of the foregoing valve-operational metal, a dielectric film ( ) formed on the surface of the sintered body and serving as a dielectric, and a solid electrolyte layer ( ) formed on the surface of the dielectric film.

Growing community of inventors

Sendai, Japan

Sadamu Toita