Mitsubishi Denki Kabushiki Kaisha

Sadamu Matsuda

Takashi Takahama

Kunito Sakai

Osamu Hayashi

Kazuo Okahashi

Ichiro Takahashi

Goro Okamoto

A method of producing a semiconductor device having a light transparent window, includes: a process of die bonding a chip onto a lead frame; a process of attaching a wall surrounding a picture element to either of the external contour surface of the surface of the chip or the light transparent window surrounding the picture element; a process of inserting the chip and the light transparent window into a metal mold in such a manner that an empty closed space is produced between the chip and the light transparent window via the wall; and a process of plastic molding the device except for the light transparent window by filling resin into the metal mold and making the resin hardened.

Method of producing a semiconductor device having a light transparent

An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube and an insulating member adhered on and around the outer peripheral surface of the metal conduit tube. The insulating member is a laminated body of a web of glass fiber impregnated with water-dispersion varnish of a hot-water resistant and thermoplastic resin and a polyether/ether/ketone resin film, which is formed by first alternately winding the glass fiber web and the resin film on and around the outer peripheral surface of the metal conduit tube for a plurality of winding turns, and then subjecting both polyether/ether/ketone resin film and glass fiber web thus wound on and around the metal conduit tube to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C, and under a pressure of from 10 kg/cm.sup.2 to 200 kg/cm.sup.2.

Electrode supporting conduit tube for electrical heating of underground

A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.

Method of resin encapsulating a semiconductor device

Semiconductor device and manufacturing method therefor

Growing community of inventors

Hyogo, Japan

Sadamu Matsuda