Kabushiki Kaisha Toshiba

Sadaki Hosomi

Kenji Unetsubo

Yoshiaki Tatumi

An electrically-insulated type semiconductor device to be resin-moulded has a rear surface which can be set in direct contact with a heat radiation section and a front surface opposite to the rear surface. This semiconductor device includes a metal lead frame having a tip end portion sandwiched between the resin rear surface and resin front surface and a mounting portion on which a semiconductor chip is mounted, and frame supporting holes formed to penetrate from the resin front surface to the mounting portion of the lead frame. The frame supporting holes are formed by supporting pins for positioning the mounting portion of the lead frame. The frame supporting holes are formed only in the resin front surface, and the lead frame is formed in such a shape that a thickness of resin mould existing between the resin rear surface and the tip end portion of the lead frame is set to be larger than a thickness of resin mould existing between the resin rear surface and the mounting portion of the lead frame.

Growing community of inventors

Hyogo, Japan

Sadaki Hosomi