Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Sadaaki Katou

Shinjiro Fujii

Aya Ikeda

Junichi Kamei

Syougo Kikuchi

Shu Hashimoto

Takuya Komine

Mika Kimura

An adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator and (d) a filler.

Adhesive composition, cured article, semiconductor device, and production method for same

An adhesive composition comprising (a) a compound having at least two ethylenically unsaturated groups, (b) a thermal polymerization initiator, (c) a hindered phenolic compound, (d) a thioether compound and (e) a compound having a thiol group.

Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element

A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100&#xb0; C. is 0.031 or less.

Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element

An adhesive composition comprising (a) an acrylic polymer having a weight-average molecular weight of 100000 or more, (b) a compound having at least two (meth)acryloyl groups and (c) a polymerization initiator, in which a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on the total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more; and the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group.

Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element

Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition. Used as the component (A) are acrylate compounds or methacrylate compounds, to be specific, an acrylate compound or a methacrylate compound having an amide group and an acrylate compound or a methacrylate compound containing a urethane bond.

Photosensitive resin composition, photosensitive film, rib pattern formation method, hollow structure and formation method for same, and electronic component

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Tokyo, Japan

Sadaaki Katou