Hitachi-high-technologies Corporation

Hitachi, Ltd.

Hitachi Displays, Ltd.

Hitachi High-tech Electronics Engineering Co., Ltd.

Sachio Uto

Toshihiko Nakata

Shunji Maeda

Akira Hamamatsu

Hidetoshi Nishiyama

Minori Noguchi

Minoru Yoshida

Hiroyuki Nakano

Yoshimasa Ohshima

Takahiro Jingu

Yuta Urano

Hiroaki Shishido

Yukihiro Shibata

Atsushi Shimoda

Yasuhiro Yoshitake

Kei Shimura

Shunzi Maeda

Masahiro Watanabe

Toshifumi Honda

Mutsuko Hatano

Shinya Yamaguchi

Makoto Ohkura

Mikio Hongo

Masataka Shiba

Yoshimasa Oshima

Mineo Nomoto

Atsushi Yoshida

Taketo Ueno

Hisashi Hatano

Yukihisa Mohara

Seiji Otani

Takahiro Togashi

Yoshitada Oshida

Takanori Ninomiya

Mitsuyoshi Koizumi

Koichi Taniguchi

Naoto Nakashima

Atsuhiro Yoshizaki

To increase the illumination efficiency by facilitating the change of the incident angle of illumination light with a narrow illumination width according to an inspection object and enabling an illumination region to be effectively irradiated with light, provided is a defect inspection method for obliquely irradiating a sample mounted on a table that is moving continuously in one direction with illumination light, collecting scattered light from the sample obliquely irradiated with the illumination light, detecting an image of the surface of the sample formed by the scattered light, processing a signal obtained by detecting the image formed by the scattered light, and extracting a defect candidate, wherein the oblique irradiation of the light is implemented by linearly collecting light emitted from a light source, and obliquely projecting the collected light onto the surface of the sample, thereby illuminating a linear region on the surface of the sample.

Defect inspection method and its device

When it is tried to detect a microscopic defect, it is desired that the width of the above-mentioned illuminated region in the minor axis direction should be short. In the related art, although an illuminated region is formed by converging light by some means, it is not easy to form an illuminated region with a narrower width. This is because various aberrations possessed by optical elements themselves used for convergence, aberrations possessed by other optical elements disposed on optical paths, assembly errors, and the like have undesired influence on the formation of linear illumination. In the related art, sufficient consideration has not been paid to the above points. The present invention is characterized in that it includes a system for changing the wavefront of light.

Inspection apparatus

A method of inspecting defects of a sample on a movable table includes a first step for, on a basis of position information of the defects which is previously detected by an other inspection system, driving the table so that the defects come into a viewing field of an optical microscope having a focus which is adjusted, a second step for re-detecting the defects to obtain a first detection result, a third step for correcting the position information of defects on a basis of position information of the re-detected defects, and a fourth step for reviewing the defects whose position information is corrected to obtain a second detection result. At the second step, re-detecting is performed using reflection light or scattered light from the sample which passes an optical filter which includes a light shielding portion and a light transmitting portion.

Method and apparatus for reviewing defects

An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. In a foreign matter anti-adhesive means, a transparent plateis placed on a placement tablethrough a frame. In the foreign matter anti-adhesive means, a shaftwhich is rotatably supported by two columnar supportsfixed onto a baseis coupled to a motorby a coupling. The shaftis inserted into a part of a framebetween the two columnar supportssuch that the frameand the transparent plateare turnable about the shaft. Therefore, the whole of the frameis opened and closed in a Z-direction about the shaft, and a waferon the placement tablecan be covered with the frameand the transparent plate

Apparatus and method for inspecting defect in object surface

When using a CCD sensor as a photo-detector in a device for inspecting foreign matters and defects, it has a problem of causing electric noise while converting the signal charge, produced inside by photoelectric conversion, into voltage and reading it. Therefore, the weak detected signal obtained by detecting reflected and scattered light from small foreign matters and defects is buried in the electric noise, which has been an obstacle in detecting small foreign matters and defects. In order to solve the above problem, according to the present invention, an electron multiplying CCD sensor is used as a photo-detector. The electron multiplying CCD sensor is capable of enlarging signals brought about by inputted light relatively to the electric noise by multiplying the electrons produced through photoelectric conversion and reading them. Accordingly, compared to a conventional CCD sensor, it can detect weaker light and, therefore, smaller foreign matters and defects.

Method for inspecting pattern defect and device for realizing the same

An inspection apparatus and method includes a light source, an illuminating unit having a polarization controller and an object lens for illuminating a specimen with light emitted from the light source and passed through the polarization controller and the object lens, a detection unit having a sensor for detecting light from the specimen illuminated by the illuminating unit, a processor which processes a signal output from the sensor so as to detect a defect on the specimen, and a display which displays information output from the processor. The processor processes an image formed from the signal output from the sensor in which the image is reduced in speckle pattern.

Method and equipment for detecting pattern defect

An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.

Defects inspecting apparatus and defects inspecting method

Apparatus and method for inspecting defect on object surface

A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.

Pattern defect inspection apparatus and method

A method and apparatus for detecting defects are provided for detecting defects or foreign matter on an object to be inspected. The apparatus includes a movable stage for mounting a specimen, an illumination system for irradiating a circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. A spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip.

Method and apparatus for detecting defects

A method and apparatus for inspecting defects includes emitting an ultraviolet light from an ultraviolet light source, illuminating a specimen with the ultraviolet light in which a polarization condition of the ultraviolet light is controlled, controlling a polarization condition of light reflected from the specimen which is illuminated by the polarization condition controlled ultraviolet light, detecting the light reflected from the specimen, processing the detected light so as to detect defects, and outputting information about the defects. The ultraviolet light source is disposed in a clean environment supplied with clean gas and separated from outside.

Apparatus and method for inspecting pattern

A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

Method of apparatus for detecting particles on a specimen

The present invention provides an inspection apparatus and inspection method. The inspection apparatus includes a stage mechanism for supporting an object under inspection. A spatial filter is provided in the detection optical system to inspect the object. A printer is used to print the results of the spatial filter. The spatial filter can be provided in the form of a Fourier transformed image.

Inspection method and inspection apparatus

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Yokohama, Japan

Sachio Uto