Murata Manufacturing Co., Ltd.

Sachio Kitagawa

Hiroshi Nakatani

Masanaga Nishikawa

Kimitoshi Nakamura

Hiroyoshi Nakagawa

An electronic component supply body and a method for manufacturing the same, which can suppress generation of wrinkles of an adhesive sheet and is unlikely to cause pickup failure of electronic component chips to occur. The supply body includes an adhesive sheet with an adhesive layer formed with an ultraviolet-curing adhesive, a ring frame bonded onto the adhesive sheet, and electronic component chips bonded onto a first region on the adhesive sheet superimposed with the opening of the ring frame. The second cured portions that are cured by being irradiated with ultraviolet rays are provided in a part of a second region forming a bonded portion between the adhesive sheet and the ring frame. Adhesive strength in the second cured portions in a shearing direction is larger than adhesive strength in a portion of the second region other than the second cured portions.

Electronic component supply body and method for manufacturing the same

A piezoelectric actuator that includes a piezoelectric substrate, first and second electrodes, and a conductive layer. The first and second electrodes are configured to apply a voltage to the piezoelectric substrate. The conductive layer is formed on the first electrode. The conductive layer is made of a metal or an alloy different in color from the second electrode.

Growing community of inventors

Nagaokakyo, Japan

Sachio Kitagawa