Ciena Corporation

Sachin Singla

Chander Prakash Gupta

Ranjeet Chaurasiya

Karan Goel

Shubham Kumar

Rampratap Mahawar

Suyash Agrawal

A networking equipment enclosure assembly, including: a base chassis; a lid coupled to the base chassis; a printed circuit board disposed within the base chassis; and a power supply unit disposed between the printed circuit board and the lid, wherein the power supply unit is spaced apart from and biased away from the printed circuit board and towards the lid via a spring mechanism coupled between the printed circuit board and the power supply unit. The networking equipment enclosure assembly also includes a heat spreader plate disposed between the power supply unit and the lid and coupled to the power supply unit. The power supply unit is biased towards the lid via the spring mechanism coupled between the printed circuit board and the power supply unit such that the heat spreader plate is pressed into thermal contact with the lid.

Outdoor networking equipment enclosure utilizing internal open frame power supply for optimum thermal management and cable minimization

The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.

Hardened optical platform including high-power electro-optics and heat dissipating circuitry and associated thermal solution

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Gurugram, India

Sachin Singla