Tokyo Ohka Kogyo Co., Ltd.

Sachiko Yoshizawa

Akiyoshi Yamazaki

Naoto Motoike

Satoshi Maemori

Masahiro Masujima

Hiroshi Shimbori

Kazuo Tani

Toshihiro Yamaguchi

A positive resist composition for forming a thick-film resist having a film thickness of 1 to 15 &#x3bc;m, the composition comprising: a resin component (A) that includes a polymer compound (A1), which has a weight average molecular weight of 20,000 to 50,000, and includes a structural unit (a1) derived from a hydroxystyrene and a structural unit (a2) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group, an acid generator component (B) that generates acid upon exposure and includes an onium salt-based acid generator having an anion moiety represented by general formula (I): R&#x2033;SO(wherein, R&#x2033; represents a linear or branched alkyl group or fluoroalkyl group of 4 carbon atoms), and a nitrogen-containing organic compound (D) that includes a tertiary aliphatic amine.

Positive resist composition for forming thick-film resist, thick-film resist laminate, and method of forming resist pattern

A positive resist composition that includes a resin component (A), which contains acid dissociable, dissolution inhibiting groups and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) is a copolymer (A1) containing a first structural unit (a1) derived from hydroxystyrene and a second structural unit (a2) derived from a (meth)acrylate ester having an alcoholic hydroxyl group, in which a portion of the hydroxyl groups of the structural units (a1) and the alcoholic hydroxyl groups of the structural units (a2) have been protected with the acid dissociable, dissolution inhibiting groups; and either the acid generator component (B) includes a diazomethane-based acid generator and an onium salt-based acid generator; or the composition further contains a compound, which contains at least one acid dissociable, dissolution inhibiting group, and generates an organic carboxylic acid under the action of acid generated from the component (B).

Positive photoresist composition and method of forming resist pattern

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Kawasaki, Japan

Sachiko Yoshizawa