Ebara Corporation

Sachiko Takeda

Ichiro Katakabe

Haruko Ono

Yuki Inoue

Masaaki Kimura

Masaki Kinoshita

Fumio Kuriyama

Nobutoshi Saito

Yugang Guo

Takashi Takemura

Shinji Kajita

Rei Kiumi

Chikako Koyama

Disclosed is a light transmitting member for a polishing pad. The light transmitting member has a cylindrical or truncated conical shape, and a screw thread is formed on a side portion thereof. A polishing pad includes such a light transmitting member and a substrate polishing apparatus includes such a polishing pad.

Light transmitting member, polishing pad, and substrate polishing apparatus

A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.

Plating method and apparatus

An apparatus for processing a substrate through successive steps including spin-drying the substrate with a single processing facility while preventing the substrate from being contaminated by a substrate processing liquid, etc. The apparatus for processing a substrate includes a substrate holder for holding and rotating a substrate, a scattering prevention cup for circumferentially surrounding the substrate held by the substrate holder to prevent a substrate processing liquid supplied to the substrate from being scattered around, and a scattering prevention cup cleaner for cleaning an inner wall surface of the scattering prevention cup.

Apparatus for and method of processing substrate

A substrate processing enables etching of a barrier metal film at around room temperature without application of a mechanical load and without excessive etching of a necessary portion of copper. The substrate processing flattens a copper film and a barrier metal film, both exposed on a surface of a substrate, by using an etching liquid capable of adjusting the etching rate ratio between the copper film and the barrier metal film.

Substrate processing method

Growing community of inventors

Tokyo, Japan

Sachiko Takeda