Shinko Electric Industries Co., Ltd.

Sachiko Oda

Junichi Nakamura

Masao Nakazawa

Kei Imafuji

Tadashi Kodaira

Masaru Yamazaki

Masahiro Yumoto

Masaki Sanada

Daisuke Takizawa

Yu Karasawa

Kinji Nagata

Kenjiro Enoki

Hiroaki Taniguchi

Tetsuo Sakaguchi

Kazuya Mukoyama

A wiring substrate includes a first substrate including a wiring layer and a solder resist layer that partially covers the wiring layer. The solder resist layer includes a circular opening partially exposing the wiring layer and a support partially covering the wiring layer within the opening. The wiring layer includes a first connection pad exposed in the opening and formed by a portion of the wiring layer located at an outer side of the support. The wiring substrate further includes a cylindrical connection pin and a bonding member that bonds a first end surface of the connection pin and the first connection pad located in the opening.

Wiring substrate and electronic device

A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

Solder bump forming method

A method of manufacturing a circuit substrate of the present invention, includes the steps of forming an n-layered (n is an integer of 1 or more) wiring layer connected electrically to a metal plate on the metal plate, forming an electroplating layer on a connection pad portion of an uppermost wiring layer of the n-layered wiring layer by an electroplating utilizing the metal plate and the wiring layer as a plating power-supply path, and removing the metal plate.

Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure

Growing community of inventors

Nagano, Japan

Sachiko Oda