Seiko Epson Corporation

Sachiko Endo

Naoyuki Toyoda

Toshiyuki Kobayashi

Noboru Uehara

Akihiko Tsunoya

A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less.

Conductive pattern formation ink, conductive pattern and wiring substrate

A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; xylitol; and a polyglycerol compound having a polyglycerol skeleton. H shown in the following formula (I) is 0.10 to 0.70, and OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents the number of hydroxyl groups in one molecule of the xylitol, Mw(B) represents a molecular weight of the xylitol, and X(B) represents a content of the xylitol in the conductive pattern forming ink in weight percent.

Conductive pattern forming ink, conductive pattern, and wiring substrate

A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent.

Growing community of inventors

Tatsuno, Japan

Sachiko Endo