International Business Machines Corporation

Saad K Doss

Dennis R McKean

Alfred Floyd Renaldo

Robert John Wilson

Edward Hin Pong Lee

Neil Leslie Robertson

Andrew Ching Tam

Glen A Garfunkel

Chie Ching Poon

Peter Beverley Phipps

George A Condas

A read head is provided with an N-cycle switch for sequentially shorting and unshorting a sense current circuit of a read head so that the read head will be protected from electrostatic discharges (ESDs) by shorting when the read head is not being tested and unshorted during tests of the read head. The shorting and unshorting switches, which are mounted on or in a slider carrying the read head, are activated by a laser beam.

Read head with N-cycle switch for electrostatic discharge (ESD) protection

A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of amninoalkylpyridine which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.

Process for patterned electroplating

A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of hydroxyquinoline which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.

Patterned electroplating

The rate of deposition of metallic film on a substrate in an electroless plating process is substantially increased without affecting film properties or causing adverse consequences to the plating bath. The boiling point of the plating bath is elevated either by adding to the bath a substance, such as ethylene glycol, which does not alter the reactivity of the bath, or by providing a sealed enclosure over the bath to increase the ambient pressure. The bath is then heated to a substantially higher temperature but below the temperature at which localized boiling occurs. Excellent metal film qualities are obtained on the substrate at a substantially higher rate than in conventional electroless plating and no nucleation sites are created in the bath to cause spontaneous decomposition of the bath.

High-rate electroless deposition process

A barrier anodizing process for an aluminum alloy substrate employs an anodizing current having a density between 20 and 300 milliamps/cm.sup.2 to produce a 300 volt barrier layer in respectively 60 and 4 second

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Gilroy, CA, United States of America

Saad K Doss