International Business Machines Corporation

Globalfoundries Inc.

Hitachi Global Storage Technologies Netherlands B.v.

Schott Ag

S Jay Chey

Hendrik F Hamann

Gareth Geoffrey Hougham

Levente Klein

Xiao Hu Liu

Michael Joseph Rooks

Mohammed S Shaikh

Marie Angelopoulos

Steven Alan Cordes

Katherina E Babich

Michael Straight Hibbs

James Patrick Doyle

Kenneth Christopher Racette

Christopher Vincent Jahnes

Paul Alfred Lauro

Nancy C LaBianca

Dustin M Fregeau

John Ulrich Knickerbocker

Siyuan Lu

Brian Richard Sundlof

Michael Alan Schappert

Timothy Charles Krywanczyk

David Michael Audette

Arpan Pravin Mahorowala

Cornelia Kang-I Tsang

Matthew T Tiersch

Robert Neal Lang

Aparna Prabhakar

Roland Nagy

Bing Dang

Bucknell Chapman Webb

Da-Yuan Shih

Prabjit Singh

Jon Alfred Casey

Sung Kwon Kang

Steven Lorenz Wright

James L Speidell

Kamalesh K Srivastava

Roy Arthur Carruthers

Donald W Henderson

C Richard Guarnieri

Donna S Zupanski-Nielsen

Joana Sofia Branquinho Teresa Maria

Cameron James Brooks

Joseph Zinter, Jr

Lavanya Turlapati

Kenneth F Latzko

David R Di Milia

Richard P Ferlita

Pavan Samudrala

Kevin Bocash

Peter Alfred Gruber

Robert J Von Gutfeld

Hemantha Kumar Wickramasinghe

Sudipta Kumar Ray

James Andrew Lacey

William K Hogan

Mitchell S Cohen

Grant W Wagner

Sherif Ahmed Goma

Matthew J Farinelli

Martin Patrick O'Boyle

James Vichiconti

Gene T Patrick

Andriy Stepanchuk

Frances Mary Ross

Doreen D DiMilia

Ranjani Sirdeshmukh

Markus Renno

Frank Sobel

Hans Becker

Sankeerth Rajalingam

Brian Richard Sundolf

Ronald Richard Breton

Michael David Fregeau

Ute Buttgereit

Gunter Hess

Oliver Goetzberger

Frank Schmidt

Mark Den Heijer

Embodiments herein describe structures of low-force wafer test probes and formation thereof. Structures of low-force wafer test probes and their formation via gray scale etch or electroplating is described. Structures are described that include a lower base structure on top of a substrate and an upper blade structure on top of the lower base structure. In various embodiments, a crown of a C4 bump is accommodated by one or both of: i) a cavity present in the lower base structure; and ii) a height of the upper blade structure. Processes for fabricating probe structures are described that include forming lower base structures upon a substrate and forming upper blade structures on top of the lower base structures. The upper blade structures include at least one blade. Each of the blade(s) include a cutting edge that points toward a center point within the probe structure.

Low-force wafer test probes

Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

Microchip substance delivery devices

A gas sensing device includes a dielectric substrate, a heater integrated into a first side of the substrate and an insulating dielectric formed over the heater. A gas sensing layer is formed on a second side of the substrate opposite the first side. Contacts are formed on the gas sensing substrate. A noble material is formed on a portion of the gas sensing layer between the contacts to act as an ionizing catalyst such that, upon heating to a temperature, adsorption of a specific gas changes electronic properties of the gas sensing layer to permit detection of the gas.

Reconfigurable gas sensor architecture with a high sensitivity at low temperatures

Microchip substance delivery devices having low-power electromechanical release mechanisms

A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.

Methods and apparatus for detection of gaseous corrosive contaminants

An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

High performance compliant wafer test probe

Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

Probe-on-substrate

Principles of the invention provide methods and apparatus for providing corrosion management in buildings. In one aspect, an exemplary method includes the step of receiving first data relating corrosion rate to a plurality of environmental conditions. This first data is subsequently utilized to determine a quantitative relationship between corrosion rate and the plurality of environmental conditions. In another step, second data indicative of one or more environmental conditions within a building is received. A corrosion rate in the building is then determined at least in part by applying the determined quantitative relationship to this second data.

Methods and apparatus for managing corrosion in buildings

An electrochemical cell apparatus is disclosed where the cell has a chamber for containing an electrolyte. The chamber is situated between a bottom and a top substrate. One or more bottom windows are in the bottom substrate and one or more top windows are in the top substrate. Each window has a window cover facing the chamber. The top window and bottom window each have a portion in alignment so that an electron beam passes through both respective portions. A spacer is deposited between the top and bottom substrate and forming walls surrounding the chamber. Two or more electrodes, each having an interior portion that is within the chamber and electrically continuous with an exterior portion external to the chamber, are located on the chamber side of the bottom substrate.

Electrochemical liquid cell apparatus

A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.

Silicon chicklet pedestal

Growing community of inventors

Ossining, NY, United States of America

S Jay Chey