Multibeam Systems Inc.

Multibeam Corporation

Motorla, Inc.

S Daniel Miller

N William Parker

Martin E Lee

Tirunelveli Subramaniam Ravi

Gerry B Andeen

Steven B Hobmann

Victor A Galande

A flat panel display substrate (FPDS) testing system configured such that prior to testing, the FPDS is loaded into a pallet to prevent breakage, and to provide electrical connections to test pads on the FPDS. The system achieves high throughput by testing FPDSs using one or more charged particle beams simultaneously with the following operations: unloading of already-tested substrates, loading of substrates ready for testing, assembly of pallets, and alignment of electrical contactors to a large number of FPDS test pads. The system design eliminates a prior art X-Y stage, and all moving electrical connections to the FPDS during testing, reducing costs and improving reliability. In one embodiment, the FPDS testing system has three subsystems: a process chamber, loadlock assembly, and pallet elevator; in another embodiment, the functions of loadlock and pallet elevator are combined to reduce system footprint.

Flat panel display substrate testing system

A detector optics system for collecting secondary electrons (SEs) and/or backscattered electrons (BSEs) in a multiple charged particle beam test system is disclosed. Aspects of the detector optics system include: the ability to image and/or electrically test a number of locations simultaneously across the full width of a large substrate with high throughput and uniform collection efficiency while avoiding crosstalk between signals generated by neighboring beams. In one embodiment, a linear array of N electron beams causes SEs to be emitted from the substrate, which are then collected by one or more linear arrays of &#x2267;2N detectors. Each linear array is connected to a signal combiner circuit which dynamically determines which detectors are collecting SEs generated by each electron beam as it scans across the substrate surface and then combines the signals from these detectors to form N simultaneous output signals (one per charged particle beam) for each detector array.

Detector optics for multiple electron beam test system

A multi-column charged particle optics assembly comprises: a first optical component which is continuous through all columns of the charged particle optics assembly; and a multiplicity of independently alignable second optical components coupled to the first optical component, such that there is one second component for each column in the charged particles optics assembly. The first component provides mechanical integrity to the charged particle optics assembly and each second optical component is independently alignable to the optic axis of its corresponding column. In a further embodiment, the charged particle optics assembly comprises: first and second continuous optical components; and a multiplicity of independently alignable electrodes coupled to the second optical component, such that there is a corresponding independently alignable electrode for each column.

Multi-column charged particle optics assembly

A system for precisely positioning and moving a platform relative to a support structure is disclosed herein. The platform is particularly suitable for carrying wafers. Charged particle optics can be attached to the support structure. The platform positioning system comprises a stage, comprising a base, a platform and stage actuators, the stage actuators being coupled to the platform and the platform being coupled to the base; a frame attached to the base; a support structure mechanically coupled to the frame; stage sensors attached to the support structure, for sensing the position of the platform relative to the support structure; and a current control system coupled to the stage sensors and the stage actuators. The current control system may include a predictor for generating an ouptut signal anticipating the actual position of the platform relative to the support structure in real time.

Platform positioning system

An image processing system for use in semiconductor wafer inspection comprises a multiplicity of self-contained image processors for independently performing image cross-correlation and defect detection. The system may also comprise an image normalization engine for performing image brightness and contrast normalization. The self-contained image processors and image normalization engine access image data from a memory array; the array is fed data from a multiplicity of imaging modules operating in parallel. The memory array is configured to allow simultaneous access for data input, normalization, and cross-correlation and defect detection. Multiple image processing systems can be configured in parallel as a single image processing computer, all sending defect data to a common display module.

Image processing system for multi-beam inspection

An electron optics assembly for a multi-column electron beam inspection tool comprises a single accelerator structure and a single focus electrode mounting plate for all columns; the other electron optical components are one per column and are independently alignable. The accelerator structure comprises first and final accelerator electrodes with a set of accelerator plates in between; the first and final accelerator plates have an aperture for each column and the accelerator plates have a single aperture such that the electron optical axes for all columns pass through the single aperture. Independently alignable focus electrodes are attached to the focus electrode mounting plate, allowing each electrode to be aligned to the electron optical axis of its corresponding column. There is one electron gun per column, mounted on the top of the single accelerator structure. In other embodiments, the electron guns are mounted to a single gun mounting plate positioned above the accelerator structure.

Growing community of inventors

Gilroy, CA, United States of America

S Daniel Miller