Hewlett-packard Development Company, L.P.

Hewlett-packard Company

S Daniel Cromwell

Stephan Karl Barsun

Bryan David Bolich

Gregory S Meyer

Eric C Peterson

James David Hensley

Raymond Joseph Iannuzzelli

Daniel Lyle Callahan

Laszlo Nobi

Zoila Vega-Marchena

Christian Laszlo Belady

A computing device includes a baseboard, a memory coupled to the baseboard, an input/output coupled to the baseboard and a processor system coupled to the baseboard. The processor system includes a circuit board, a central electronic control coupled to the circuit board and a processor component. The device further includes a first structure coupling the processor component to the circuit board and retaining the processor component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The first structure is movably coupled to one of the processor component and the circuit board for movement in a direction perpendicular to the first axis at least prior to being coupled to the other of the processor component and the circuit board.

Computing device

A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.

Force distributing spring element

Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.

Wedge lock

A circuit board assembly includes a circuit board, an electronic component and a structure coupling the electronic component to the circuit board. The structure retains the electronic component relative to the circuit board at a selected one of a plurality of positions in both directions along an axis perpendicular to the circuit board. The structure is movably coupled to one of the electronic component and the circuit board in a direction perpendicular to the axis at least prior to being coupled to the other of the electronic component and the circuit board.

Circuit board assembly

A circuit board assembly includes a circuit board, an electronic component, a plurality of incremental detents and at least one projection. The plurality of incremental detents are coupled to one of the circuit board and the electronic component and are retained relative to said one of the circuit board and the electronic component against linear movement in both directions along a first axis. The at least one projection is coupled to the other of the circuit board and the electronic component and is retained against linear movement along the first axis. The at least one projection is received within at least one of the plurality of detents to retain the electronic component relative to the circuit board against linear movement in both directions along the axis.

A spring-loaded heat sink assembly for a circuit assembly, an installation tool, and a method of installation. The assembly comprises a heat sink, a load plate, and at least one leaf spring positioned therebetween. The load plate comprises elongate shafts having an open channel therethrough which extend through the leaf spring(s) and heat sink and at least partially through the circuit assembly. The elongate shafts provide a space for the leaf spring(s) between the heat sink and load plate. Fasteners extend through the elongate shafts to connect the spring-loaded heat sink assembly to the circuit assembly.

Spring-loaded heat sink assembly for a circuit assembly

A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus includes a field replaceable apparatus and a receiving apparatus and attenuates EMI. By integrating mechanical, electrical, and thermal management features the modular integrated apparatus improves the process of repairing and upgrading the processor at a customer site by simplifying the modular integrated apparatus package. Additionally, by reducing the number of parts and the amount of circuit board space required to connect a processor to a thermal plate, the present embodiment improves ease of use and acts as a handle in its own installation and removal. Further, by including the processor and a heat sink in the field replaceable apparatus, the field replaceable apparatus reduces handling in the field and the risk of damage to the processor, and may be tested prior to installation in the field to ensure it operates properly.

Method for making a modular integrated apparatus for heat dissipation

A method and apparatus for assembling a high speed, high density VLSI module in a computer system that enables attachment, support, electromagnetic interference containment, and thermal management of the VLSI module. The present invention packages a high speed, high density VLSI module within a limited space and in a single assembly that attaches, aligns, and manages electromagnetic interference and heat dissipation of the VLSI module. The present invention aligns a land grid array of a circuit board and an interposer socket assembly, and the interposer socket assembly and a land grid array of the VLSI module; in the single VLSI module assembly. An even, controlled load is placed on the interposer socket interface thereby reducing the risk of damage to the interposer socket from overloaded connections between the land grid array of the VLSI module, the interposer socket assembly, and the land grid array of the circuit board. The present invention is easy-to-use in upgrading and handling of the VLSI module.

Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules

A compact cooling method and apparatus arranged for simultaneously drawing heat from both a processor and from the voltage regulator. The invention provides for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation. The invention includes a processor requiring at least one bias voltage, and further includes a companion voltage regulator for providing the bias voltage. The voltage regulator is arranged sufficiently proximate to the processor, so as to limit inductance of electrical coupling therebetween.

Cold plate arrangement for cooling processor and companion voltage regulator

A package for heat sinks and semiconductor components that adequately dissipates heat from semiconductor components without damaging or bending the semiconductor component electrical grid terminals and without imposing mechanical stress on the semiconductor component. The package includes both the heat sink and the semiconductor component situated in one unit that minimizes the thermal path. The heat sink and semiconductor component package may be packaged in a field replaceable unit (FRU) and may act as a handle for use in its own replacement. The FRU contains the heat sink and the semiconductor component in one unit, and thereby enables safe, simplified, and cost effective maintenance, including removal and addition of the semiconductor components, outside of the manufacturing environment. The package further includes a docking assembly mounted on a printed circuit board that orients and positions the FRU to align the semiconductor component and the electrical grid terminals for insertion on the printed circuit board.

Perimeter clamp for mounting and aligning a semiconductor component as

Method and apparatus for a modular integrated apparatus for heat

A modular integrated computer apparatus that includes a CPU or VLSI module connected to a printed circuit board, a power converter, and one or more associated electric power cables; and is a supporting infrastructure that ensures ease of use. The field replaceable apparatus may also function as an EMI enclosure and a heat management device. The field replaceable apparatus may be inserted and removed from a computer system by handles that are attached to the modular integrated apparatus. The installed field replaceable apparatus is positioned to ensure that the CPU module is properly connected to the printed circuit board.

Method and apparatus for a modular integrated apparatus for

A circuit board insertion and extraction apparatus. The present invention is a circuit board inserter and extractor apparatus particularly suited for use with circuit boards utilizing high insertion force connectors requiring in excess of 50 lbs of force. The handle of the inserter/extractor has novel insertion and extraction surfaces which cooperate with corresponding surfaces fabricated as part of a card guide. As the circuit board is inserted into the card guide, the handle is automatically positioned so that the user can press the bottom of the handle to insert the circuit board. The handle and card guide interface is designed to provide a large positive force to extract the circuit board from the card guide until the circuit board is unseated from the associated high insertion force connectors. Additionally, the present invention is advantageously designed to eliminate the need for fixtures or separate hardware to install the handle onto the circuit board thereby saving assembly line time and money.

Growing community of inventors

Penryn, CA, United States of America

S Daniel Cromwell