Nexperia B.v.

Rüdiger Weber

Wolfgang Schnitt

Hans-Juergen Funke

Rolf Brenner

Frank Burmeister

Tobias Sprogies

A method of protecting sidewalls a plurality of semiconductor devices is disclosed. The method includes fabricating the plurality of semiconductor devices on a semiconductor wafer, etching to form a trench grid network on the backside of the semiconductor wafer. The trench grid network demarcate physical boundaries of each of the plurality of semiconductor devices. The method also includes depositing a protective layer on the backside and etching to remove the protective layer from horizontal surfaces and to singulate each of the plurality of semiconductor devices from the semiconductor wafer.

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Pinneberg, Germany

Rüdiger Weber