Dtg International Gmbh

Rüdiger Dehmel

Andreas Gülzow

Michael Holzbrecher

Edward Bruchwald

The invention relates to a contacting unit for a test apparatus for testing printed circuit boards. The contacting unit comprises a full grid cassette and an adapter. The full grid cassette is provided with a plurality of spring contact pins arranged in the grid of contact points of a basic grid of a test apparatus. The adapter is provided with test needles for electrically connecting each of the spring contact pins of the full grid cassette to a circuit board test point of a printed circuit board to be tested, the spring contact pins being secured in the full grid cassette against falling out on the side remote from the adapter and the test needles being secured in the adapter on the side remote from the full grid cassette. The adapter and the full grid cassette are releasably joined to each other. In this way, both the spring contact pins and the test needles are secured against falling out of the contacting unit in the assembled state of the adapter and the full grid cassette.

Contact-connection unit for a test apparatus for testing printed circuit boards

The invention relates to a full grid cassette for a parallel tester for testing a non-componented printed circuit board, to a spring contact pin for such a full grid cassette and to an adapter for a parallel tester for testing a non-componented printed circuit board.

Full grid cassette for a parallel tester for testing a non-componented printed circuit board, spring contact pin for such a full grid cassette and adapter for a parallel tester for testing a non-componented printed circuit board

The invention relates to a module for a parallel tester for the testing of circuit boards, and to a parallel tester comprising such modules. The modules have circuit boards standing at right-angles to the plane of the basic grid of the parallel tester, and on which contact pins are arranged along one side edge. The contact pins lie with their peripheral surfaces on flat sides of the circuit boards and protrude a short distance beyond the side edge of the circuit board. They are connected electrically and physically to contact fields formed on the circuit board. This arrangement of the contact pins is cost-effective to produce, mechanically stable, and permits the production of modules with a high density of contact pins.

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Wunstorf, Germany

Rüdiger Dehmel