Nec Electronics Corporation

Ryuya Kuroda

Hirochika Narita

Yoichiro Kurita

Takehiro Kimura

Satoko Kawakami

In a multi-chip package having vertically stacked semiconductor integrated circuits (chips), a heat transmitting conductive plate () can be interposed between a lower layer semiconductor chip () and an upper layer semiconductor chip () and connected to a ground wiring of a substrate () through a bonding wire (). A heating transmitting conductive plate () at the ground potential can block propagation of noise between the lower layer semiconductor chip () and upper layer semiconductor chip (). Thus, the addition of noise to signals of an analog circuit in the upper layer semiconductor chip () can be avoided, reducing noise induced malfunctions. Furthermore, heat generated by the lower layer semiconductor chip () and upper layer semiconductor chip () can be transmitted through contact points with the heat transmitting conductive plate () for dissipation therefrom. This can improve heat dissipating capabilities of the semiconductor device () contributing to more stable operation.

Semiconductor device including a heat-transmitting and electromagnetic-noise-blocking substance and method of manufacturing the same

To provide a solid-state image sensing device that is capable of improving the connection reliability of bonding pads and bonding wires. A solid-state image sensing elementof the present invention contains a long plate-shaped metal substrate, a long plate-shaped solid-state image sensing elementfixed to the surface of the metal substratevia an adhesive layer, and bonding pads, formed on the surface of the solid-state image sensing element, for electrically connecting to the lead frame via bonding wires. The adhesive layercontains a first adhesive layer, and a second adhesive layerof a higher modulus of elasticity than the first adhesive layer, and at the regions directly below the bonding padsprovided at both end sections in a longitudinal direction of the solid-state image sensing element, the metal substrateand the solid-state image sensing elementare fixed via the second adhesive layer

Adherence of a solid-state image-sensing device to a substrate

Method of manufacturing a solid-state image-sensing device includes: forming a composite lead frame which is a lead unit separated from a metal substrate surface by connecting a pair of lead frames having rectangular outer frame units, lead units formed integrally with the outer frame units within the frames, and bump units formed at one surface of the outer frame units, via the bump units of the lead frames on surfaces of both ends of the long plate-shaped metal substrate, filling up a gap between the surface of the metal substrate and the lead units with insulating resin, and forming an outer frame body by molding part of the composite lead frame so as to expose the connecting units and the lead unit to the outside, mounting a long plate-shaped solid state image sensing element on the composite lead frame, and cutting off the connecting units exposed to the outside.

Growing community of inventors

Kanagawa, Japan

Ryuya Kuroda